XC7K160T-2FBG676C by AMD FPGAs | Avnet Asia Pacific

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XC7K160T-2FBG676C

FPGA, Kintex-7, MMCM, PLL, 250 I/O's, 710 MHz, 162240 Cells, 970 mV to 1.03 V, FCBGA-676, NCNR

XC7K160T-2FBG676C in FPGAs by AMD
AMD
Manufacturer: AMD
Product Category: Programmable Logic, FPGAs
Avnet Manufacturer Part #: XC7K160T-2FBG676C
Datasheet
XC7K160T-2FBG676C
RoHS 10 Compliant

Xilinx 7 series FPGAs comprise three new FPGA families that address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding high-performance applications. The 7 series FPGAs include:
  • Kintex-7 Family: Optimized for best price-performance with a 2X improvement compared to previous generation, enabling a new class of FPGAs.
Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, 7 series FPGAs enable an unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.

Key Features

  • Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.
  • 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.
  • High-performance SelectIO technology with support for DDR3 interfaces up to 1,866 Mb/s.
  • High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.
  • A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.
  • DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.
  • Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.
  • Integrated block for PCI Express (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.
  • Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
  • Low-cost, wire-bond, lidless flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.
  • Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.

Technical Attributes

Find Similar Parts
Description Value
Operating Temperature Max 85
IC Case / Package Lidless FCBGA
No. of User I/Os 250
No. of Logic Cells 162
No. of Pins 676
Speed Grade 2
IC Mounting Surface Mount

ECCN / UNSPSC / COO

Description Value
ECCN: 3A991.d
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Documents

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Documents

Title Download Type Date Published
Kintex-7 FPGA Product Brief Product-Guides 20130331
7 Series FPGAs Family Overview Product-Guides 20130331
7 Series FPGAs Clocking Resources Guide User-Guides 20130331
Selector-Guides
7 Series FPGAs Memory Resources Guide User-Guides 20130331
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