AS4C128M16D2A-25BIN by Alliance Memory DRAMs | Avnet Asia Pacific

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AS4C128M16D2A-25BIN

DRAM Chip DDR2 SDRAM 2Gb 128M x 16 1.8V 84-Pin TFBGA

Alliance Memory
Manufacturer: Alliance Memory
Product Category: Memory, DRAMs
Avnet Manufacturer Part #: AS4C128M16D2A-25BIN
RoHS 10 Compliant

The 2Gb DDR2 is a high-speed CMOS Double-DataRate-Two (DDR2), synchronous dynamic random - access memory (SDRAM) containing 2048 Mbits in a 16- bit wide data I/Os. It is internally configured as a 8-bank DRAM, 8 banks x 16Mb addresses x 16 I/Os. The device is designed to comply with DDR2 DRAM key features such as posted CAS# with additive latency, Write latency = Read latency -1, Off-Chip Driver (OCD) impedance adjustment, and On Die Termination(ODT).All of the control and address inputs are synchronized with a pair of externally supplied differential clocks. Inputs are latched at the cross point of differential clocks (CK rising and CK# falling). All I/Os are synchronized with a pair of bidirectional strobes (DQS and DQS#) in a source synchronous fashion. The address bus is used to convey row, column, and bank address information in RAS #, CAS# multiplexing style. Accesses begin with the registration of a Bank Activate command, and then it is followed by a Read or Write command. Read and write accesses to the DDR2 SDRAM are 4 or 8-bit burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Operating the eight memory banks in an interleaved fashion allows random access operation to occur at a higher rate than is possible with standard DRAMs. An auto precharge function may be enabled to provide a self-timed row precharge that is initiated at the end of the burst sequence. A sequential and gapless data rate is possible depending on burst length, CAS latency, and speed grade of the device.

Key Features

  • JEDEC Standard Compliant
  • JEDEC standard 1.8V I/O (SSTL_18 compatible)
  • Power supplies: VDD & VDDQ +1.8V ± 0.1V
  • Operating temperature:
    • Commercial (0 ~ 85 °C)
    • Industrial (-40 ~ 95 °C)
  • Supports JEDEC clock jitter specification
  • Fully synchronous operation
  • Fast clock rate: 400MHz
  • Differential Clock, CK & CK#
  • Bidirectional single/differential data strobe
    • DQS & DQS#
  • 8 internal banks for concurrent operation
  • 4-bit prefetch architecture
  • Internal pipeline architecture
  • Precharge & active power down
  • Programmable Mode & Extended Mode registers
  • Posted CAS# additive latency (AL): 0, 1, 2, 3, 4, 5
  • WRITE latency = READ latency - 1 tCK
  • Burst lengths: 4 or 8
  • Burst type: Sequential / Interleave
  • DLL enable/disable
  • Off-Chip Driver (OCD) - Impedance Adjustment - Adjustable data-output drive strength
  • On-die termination (ODT)
  • RoHS compliant
  • Auto Refresh and Self Refresh
  • 8192 refresh cycles / 64ms - Average refresh period 7.8µs @ -40°C ≦TC≦ +85°C 3.9µs @ +85°C <TC≦ +95°C
  • Package: 84-ball 8 x 12.5 x 1.2mm (max) FBGA
    • Pb Free and Halogen Free

Technical Attributes

Find Similar Parts
Description Value
DRAM Type DDR2 SDRAM
IC Mounting Surface Mount
IC Case / Package TFBGA
Operating Temperature Max 95 °C
Clock Frequency Max 400 MHz
Memory Configuration 128M x 16
Supply Voltage Nom 1.8 V
Memory Density 2 Gbit
Operating Temperature Min -40 °C
No. of Pins 84

ECCN / UNSPSC / COO

Description Value
ECCN: EAR99
SCHEDULE B: 8542330000
HTSN: 8542330001
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