ビームフォーミングの基礎(英語)
フェーズドアレイシステムのビームフォーミング理論とザイリンクスZynq®UltraScale+™RFSoCでの実装について説明します。
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Check out Amphenol's industry-leading array of sophisticated connector products for increased speed, capacity, and durability in the sub applications and devices of the 5G network.
Molex
Improve your communication systems with the latest connectivity products required to drive your 5G design.
Xilinx
5G mmWave - Xilinx’s unique portfolio of silicon and IP enables OEM’s to architect systems best suited to their unique requirements to address panel size, weight, power, and cost constraints.
Amphenol RF
Check out Amphenol's industry-leading array of sophisticated connector products for increased speed, capacity, and durability in the sub applications and devices of the 5G network.
Murata
Murata is committed to developing component solutions to support these new device challenges: Scalability, Thermal management, Miniaturization, Extended battery life, Low latency.
Bel
Bel offers a large and growing solutions for 5G which cover power, connectivity, Ethernet, circuit protection and integrated connector module.
Nexperia
Nexperia's essential semiconductor products are recognized as benchmarks in efficiency – in process, size, power and performance — with industry-leading small packages that save valuable energy and space, accelerating 5G designs.
Micron
From better health care technology through Internet of Things (IoT) to advances in AI-powered mobile photography — Micron memory and storage will drive 5G innovation.
TE Connectivity
Discover how TE Connectivity is enabling adoption of 5G networks with its range of wireless, sensor and connector solutions.