Automotive MOSFETs with Small Package

Toshiba Electronic Devices & Storage Corporation ("Toshiba") introducing the N-channel MOSFETs "XSM6K361NW, XSM6K519NW, XSM6K376NW, XSM6K336NW," and the P-channel MOSFET "XSM6J372NW."

Toshiba has launched five products of automotive MOSFETs that combine space-saving and high-mountability by using small DFN2020B(WF) package with a wettable flank structure. 

The Toshiba's DFN2020B(WF) package of automotive MOSFETs is with a wettable flank structure, which improves the solder wettability compared to Toshiba’s existing UDFN6B package. In addition, the improved visibility of the solder fillet allows for confirmation of solderability in automatic visual inspection (AVI) equipment, contributing to the automation of inspection on the manufacturing line. Furthermore, in the solder joint mounting shear strength test, it is approximately 23% stronger than Toshiba’s existing SOT-23F package, contributing to improved reliability of the equipment.

The package size of DFN2020B(WF) is 2.0×2.0×0.6mm (typ.), which reduces the mounting area by approximately 43% and the package height by approximately 25% compared to the SOT-23F package, contributing to the miniaturization of equipment. Furthermore, it features a high power dissipation despite a small package. The maximum power dissipation rating of XSM6K361NW, one of new products, is 1.84W.

The new products comply with AEC-Q101, the automotive industry standard reliability test specification.  The PPAP of IATF16949, the international standard for quality management systems specific to the automotive industry, is available. These products can be used in various automotive applications such as DC-DC converters in ECUs and LED headlamp load switches.

Toshiba will continue to expand its lineup of MOSFET and 2in1 MOSFET products for automotive applications, housed in packages with wettable flank structure.

Features

• Package with wettable flank structure enables automatic visual inspection of board mounting conditions
• Small, low profile high power dissipation package
   

Application

       Automotive equipment

• DC-DC converters for ECUs, load switches for LED headlamps, etc.

Benefits

• Improved visibility of the solder fillet which contributing to the automation of inspection on the manufacturing line.
• Improve reliability in solder joint mounting shear strength test.       
   

Block Diagram