XCede® HD High-Density Backplane System

Samtec's XCede® HD high-density backplane system features a small form factor ideal for density-critical applications, and a modular design for flexibility and customizable solutions.

XCede® HD combines a small form factor with incredible design flexibility for significant board and system space savings. The system’s modularity gives designers the opportunity to create a fully custom backplane solution with optional power modules, guidance & keying, and side walls for increased durability. Featuring a staggered differential pin design, the ground pins mate first for hot-plugging to help prevent system downtime.

Features

• Small form factor provides significant space savings
• Modular design provides flexibility in applications
• High-density backplane system – up to 84 differential pairs per linear inch
• 1.80 mm column pitch
• 3-, 4- and 6-pair designs
• 4, 6 or 8 columns
• 12–48 pairs
• Up to a 3.00 mm contact wipe on signal pins
• Multiple signal/ground pin staging options
• Integrated power, guidance, keying and side walls available
• 85 Ω and 100 Ω options
• Three levels of sequencing enable hot plugging
• Cost-effective designs available for low-speed applications
• Power modules (HPTT/HPTS) are available as a standalone power solution with 10 Amps max per blade

Application 

• Energy
• Automotive & Transportation
• COMPUTER
• Mecical
• Datacom
• AI
• Industrial/IIoT

Block Diagram