AcceleRate® mP High-Density, High-Speed Signal/Power Arrays
Samtec’s flexible power solutions are available as high power only or power/signal combinations up to 60 Amps with high-density power blades in small form factors. Board-to-board and discrete wire cable assemblies available.
These 0.635 mm pitch high-density, high-speed signal/power arrays achieve 64 Gbps PAM4 speeds and feature rotated power blades for improved performance and simplified breakout region (BOR).
Features
- Best in class density for power and signal
- Power blades rotated 90º gives equal access to heat escape for uniform cooling, increased current capacity and reduced crowding
- Supports 64 Gbps PAM4 (32 Gbps NRZ) applications
- PCIe® 6.0/CXL® 3.2 capable
- Open-pin-field design for maximum grounding and routing flexibility
- High-density multi-row design
- Low profile 5 mm and 10 mm stack heights; up to 16 mm on roadmap
- 4 or 8 total power blades; up to 10 in development
- 60 or 240 total signal positions; additional position counts in development
- 0.635 mm signal pitch
- Optional alignment pins
- Standard weld tabs for a secure connection to the board
- Polarized guide posts for blind mating
Application
- Energy
- Automotive & Transportation
- COMPUTER
- Mecical
- Datacom
- AI
- Industrial/IIoT
