LP Array™ Low Profile Open-Pin-Field High-Density Array
A wide variety of Samtec interconnect solutions are available to support C-V2X technology related needs. These low profile open-pin-field arrays feature stack heights down to 4 mm with up to 400 total I/Os.
C-V2X (Cellular Vehicle-to-Everything) technologies go beyond line-of-sight systems to enable vehicle intelligence, improve traffic flow, and increase safety by leveraging next-generation 5G networks and cloud services. This interconnected ecosystem requires a reliable communications infrastructure for high-speed and high-frequency data exchange. Samtec’s automotive interconnect portfolio helps route data from radios to sensors throughout the vehicle.
These low profile, high-speed arrays feature a dual beam contact system on a 1.27 mm x 1.27 mm (.050" x .050") pitch grid for maximum grounding and routing flexibility. This system is available in 4 mm, 4.5 mm and 5 mm mated heights with up to 400 total pins in 4, 6 or 8 row configurations.
They support 56 Gbps PAM4 applications and are also Final Inch® certified for Break Out Region trace routing recommendations to save designers time and money. Standard lead-free solder crimp simplifies IR reflow terminations and improves solder joint reliability.
Features
- 4 mm, 4.5 mm, 5 mm stack heights
- Up to 400 I/Os
- 4, 6 and 8 row designs
- .050" (1.27 mm) pitch
- Dual beam contact system
- Solder crimp termination for ease of processing
- 56 Gbps PAM4 performance
- Analog Over Array™ capable
Application
- Automotive & Transportation
- COMPUTER
- Mecical
- Energy
- Datacom
- AI
- Industrial/IIoT
