Infineon brings decades of expertise in security, connectivity, and sensor technologies, delivering cutting-edge solutions tailored to meet the demands of smart homes. With an emphasis on exceptional performance, robust security, unmatched reliability, and energy efficiency, Infineon empowers innovative and future-ready smart home applications.
Our comprehensive product portfolio offers the ultimate Smart Lock solutions designed to address evolving needs. From always-on, low-power wireless connectivity to industry-proven security featuring pre-provisioned keys and certificates, Infineon ensures seamless integration across the entire smart door lock system. With us, you can trust in intelligent, secure, and energy-efficient solutions that elevate your smart home experience.
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The Infineon XENSIV™ TLI493D family offers ultra-compact, low-power 3D magnetic sensors ideal for industrial and consumer applications. With a tiny WLB-5 package (1.13mm x 0.93mm x 0.59mm) and 7 nA power-down current, it enables efficient performance, replacing traditional resistor-based or optical solutions in space-constrained designs.
Key features:
- 3D (X, Y, Z) magnetic flux density sensing of ±160 mT
- Programmable flux resolution down to typ. 65 µT
- Extremely small form factor: typ. 1.13 mm * 0.93 mm * 0.59 mm
- X-Y angular measurement mode
- Power down mode with 7 nA (typ.) power consumption
- 12-bit data resolution for each measurement direction plus 10-bit temperature sensor
- Variable update frequencies and power modes (configurable during operation)
- Temperature range Tj = -40°C…125°C, supply voltage range = 2.8 V…3.5 V
- Triggering by external microcontroller possible via I2 C protocol
- Interrupt signal to indicate a valid measurement to the microcontroller
NAC1080 NFC actuation controller with integrated H-bridge and energy harvesting modules
The NAC1080 is a NFC actuation controller with integrated H-bridge and energy harvesting modules, enabling cost-effective development of passive smart actuators like passive locks.
Key features:
- NFC interface compliant to ISO 14443 type A Arm® 32bit Cortex®-M0 microcontroller core
- Dual-operation mode: passive- or battery-mode
- Memory:
- 16kB ROM as bootloader
- 16kB RAM
- 60kB NVM
- Digital I/O: SPI, UART
- Integrated H-bridge supports up to 250mA load current
- Available in DSO-16 package
32-bit PSoC™ 6 Arm® Cortex®-M4 / M0+ Microcontrollers Purpose-Built for the IoT
The PSoC™ 6 family is built on an ultra-low-power architecture, and the MCUs feature low-power design techniques that are ideal for battery powered applications. The dual-core Arm® Cortex®-M4 and Cortex-M0+ architecture lets designers optimize for power and performance simultaneously.
Key features:
- Dual Core CPU Architecture (150 MHz Arm Cortex-M4, 100 MHz Arm Cortex M0-p)
- DMA Controllers
- QSPI External Memory I/F
- CapSense
- I2C
- UART
- SPI
- USB-FS
- 12-bit SAR ADC
- Low Power Comparator
- RTC
- Timer, Counter, PWM
- Segment LCD
- Crypto Accelerator (DES/TDES, AES, SHA, CRC, TRNG, RSA/ECC)
- SWD/JTAG Program and Debug
- OTP Memory
- -40 ºC to 85 ºC
AIROC™ Wi-Fi & Combos portfolio
Infineon’s AIROC™ Wi-Fi & Combos portfolio integrates IEEE 802.11a/b/g/n/ac/ax Wi-Fi and Bluetooth® 5.2 in a single-chip solution to enable small-form-factor IoT designs.AIROC™ Wi-Fi SOCs include on-chip MCUs, memory, and the networking protocols required for customers to easily create their own cloud-connected applications.
Key features:
- Shared SDIO interface
- 1x1 SB 11n/ac Wi-Fi
- Bluetooth 5.1 with Mesh
- Simultaneous dual band (RSDB)
- Low power architecture
- Clean 6G spectrum
- Enhanced Range Boost
- PCIe
- Power saving by TWT
- Cirrent Product Analytics
PSOC™ 4 Arm® Cortex®-M0/M0+ (Multi-Sense on PSOC™ 4)
The PSoC™ 4 portfolio features Arm® Cortex®-M0/M0+ microcontrollers with Infineon's CapSense for capacitive sensing, customizable analog front ends via programmable analog blocks, and connectivity options like USB, CAN, and Bluetooth Low Energy, offering a flexible, scalable, and low-power mixed-signal architecture for diverse applications.
Key features:
- 32-bit MCU subsystem
- 48-MHz Arm® Cortex®-M0+ CPU
- Up to 128 KB of flash.
- Up to 32KB of SRAM
- DMA controller
- 12-bit, 1-Msps SAR ADC
- 5th generation CAPSENSE™ technology:
- Self-Capacitive Sensing
- Mutual capacitive sensing
- Inductive sensing
- Liquid level sensing
- Hover touch
- 32 sensor inputs
- Up to 32 self-capacitive inputs
- Up to 256 mutual-capacitive inputs
- Up to 16 inductive inputs
- Up to 53 programmable pins, 8 smart I/O
- 1% IMO
- Improved ESD, up to 6.5KV HBM
- Six 16 bit-time/counter/pulse-width modulator (TCPWW) blocks
- Two configurable serial communication blocks (SCBs) to support I2C, SPI or UART interface. Three dedicated UART
- Superior user experience: Proximity, capacitive Touch, capacitive Slider, Finger-tracking, hover touch, Metal-touch, Force-touch.
- High resolution liquid level detection, contactless stack up.
- Best-in-class signal-to-noise ratio
- Operating Voltage: 1.71V to 5.5V
- Deep sleep mode at 8 µA through “Always-on” sensing
- Active touch detection and tracking at 300 µA (average)