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headline - efuse-solution

Efuse Solution

Description - efuse-solution

This solution is a high-current EFUSE solution, designed based on Infineon's high-side driver 2ED2410, with the main control platform being CY2B75 and a current rating of 300A.

It is applicable to scenarios such as domain control or PDU primary distribution and 12V lithium battery switch protection, replacing traditional fuses and relays. When a fault occurs, it can quickly cut off the load and effectively protect the wiring harness at the same time.

Features

1-channel device with two high-side gate driver outputs;
3 Ω pull-down and 50 Ω pull-up for fast turn-on/turn-off of the switch;
Supports back-to-back MOSFET topology (common drain and common source);
Two bidirectional high-side analog current sense interfaces with externally adjustable gain;
Adjustable overcurrent and short-circuit protection;
Integrated multi-function comparator: configurable I-t curve protection, overvoltage/undervoltage or overtemperature protection.

Static - efuse-solution

Key components

2ED2410 --- high-side gate driver
CY2B75 --- MCU
IAUAN04S7N005 --- MOSFET
TLE9461---SBC

Applications

Power Distribution Unit

Benefits

Short-circuit protection: When the detected current reaches the designed threshold, the chip triggers fast protection and shuts down the output, with the whole process completed within microsecond level.
I-t protection: When the actual current hits the configured value, the chip activates protection following the RC filter time constant design. The actual tested protection time is within the designed range.
Quiescent current test: On the current evaluation board, the quiescent power consumption is about 125 μA when DG1/DG0 are left floating, and around 165 μA when the pins are connected.
Software design: Developed based on CY2B75, it supports pre-charge and protection functions. Real-time sampling is implemented via ADC ports with configurable protection current threshold. Verified by tests, it can protect the system in real time and serve as a redundant design.
Thermal design: Compatible with both heat sink mounting and copper plate heat dissipation schemes, allowing flexible configuration according to customer application conditions.
Temperature rise test: Since the test condition of 300A (four devices in parallel) is not available at present, a test with two devices in parallel at 140A was conducted. The short-term temperature rise is around 60 ℃.