TC358775XBG(EL1)

The TC358775XBG Functional Specification defines operation of the DSI TO LVDS low power chip (or more abbreviated, TC358775XBG chip) 775XBG is the follow-up chip of TC358775XBG which: Is pin compatible to TC358764XBG,Exhibit LVDS Tx block operates at 1.8V @135 MHz to reduce operation power, Update 4-lane DSI Rx max bit rate @ 1 Gbps/lane to support 1920×1200×24 @60fps,Add STBY pin with to enable turning on VDDIO power first before other power supplies.

The primary function of this chip is DSI-to-LVDS Bridge, enabling video streaming output over DSI link to drive LVDS-compatible display panels. The chip supports up to 1600×1200 24-bit pixel resolution for single-link LVDS and up to WUXGA (1920×1200 24-bit pixels) resolution for dual-link LVDS. As a secondary function, the chip also supports an I2C Master which is controlled by the DSI link; this may be used as an interface to any other control functions through I2 C.

• DSI Receiver
  • Configurable 1- up to 4-Data-Lane DSI Link with bi-directional support on Data Lane 0
  • Maximum bit rate of 1 Gbps/lane
  • Video input data formats:
  • RGB565 16 bits per pixel
  • RGB666 18 bits per pixel
  • RGB666 loosely packed 24 bits per pixel
  • RGB888 24 bits per pixel
  • Video frame size:
  • Up to 1600×1200 24-bit/pixel resolution to single linkLVDS display panel, limited by 135 MHz LVDS speed
  • Up to WUXGA resolutions (1920×1200 24-bit pixels) to dual-link LVDS display panel, limited by 4 Gbps DSI link speed
  • Supports Video Stream packets for video data transmission.
  • Supports generic long packets for accessing the chip's register set
  • Supports the path for Host to control the on-chip I2C Master
• LVDS FPD Link Transmitter
  • Supports single-link or dual-link
  • Maximum pixel clock frequency of 135 MHz.
  • Maximum pixel clock speed of 135 MHz for singl