AS4C64M16D3LB-12BIN
DRAM, DDR3L, 1 Gbit, 64M x 16bit, 800 MHz, 96-Pin, FBGA
- RoHS 10 Compliant
- Tariff Charges
AS4C64M16D3LB-12BIN is a 64M x 16bit DDR3L synchronous DRAM (SDRAM). The 1Gb Double-Data-Rate-3 (DDR3L) DRAM is a double data rate architecture to achieve high-speed operation. It is internally configured as an eight-bank DRAM. The 1Gb chip is organized as 8Mbit x 16 I/Os x 8 bank devices. It achieves high-speed double-data-rate transfer rates of up to 1600Mb/sec/pin for general applications. The chip is designed to comply with all DDR3L DRAM key features and all of the control and address inputs are synchronized with a pair of externally supplied differential clocks. Inputs are latched at the cross point of differential clocks (CK rising and CK# falling). All I/Os are synchronized with differential DQS pairs in a source-synchronous fashion.
- JEDEC standard compliant, supports JEDEC clock jitter specification
- Fully synchronous operation, fast clock rate: 800MHz, differential clock, CK and CK#
- Bidirectional differential data strobe, DQS and DQS#, 8 internal banks for concurrent operation
- 8n-bit prefetch architecture, pipelined internal architecture, precharge and active power down
- Programmable mode and extended mode registers, additive latency (AL): 0, CL-1, CL-2
- Programmable burst lengths: 4, 8, burst type: sequential/interleave
- Output driver impedance control, write levelling
- ZQ calibration, dynamic ODT (Rtt-Nom and Rtt-WR), auto refresh and self refresh
- 96-ball FBGA package
- Industrial temperature range from -40°C to 95°C
Technical Attributes
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| Description | Value | |
|---|---|---|
| 800 MHz | ||
| DDR3L | ||
| FBGA | ||
| Surface Mount | ||
| 64M x 16bit | ||
| 1 Gbit | ||
| 96 | ||
| 8 | ||
| 95 °C | ||
| -40 °C | ||
| 1.35 V |
ECCN / UNSPSC / COO
| Description | Value |
|---|---|
| Country of Origin: | null |
| ECCN: | EAR99 |
| HTSN: | 8542330001 |
| Schedule B: | 8542330000 |