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STMicroelectronics ISM330DLC

STMicroelectronics ISM330DLC - iNEMO® 6-axis system-in-package with high accuracy and ultra-low power for Industry 4.0

Image of STMicroelectronics ISM330DLC chip

Combining a 3D accelerometer and 3D gyroscope, ST’s ISM330DLC system-in-package is the latest generation of high-performance 6-axis MEMS inertial modules specifically designed for Industry 4.0. The ISM330DLC offers best–in-class accuracy and flexibility with ultra-low power consumption, enabling demanding applications, even battery-operated ones, in the industrial domain. High-performance, high-quality, small size and low power consumption together with high robustness to mechanical shock makes the ISM330DLC the right choice for the implementation in reliable industrial products.

Key features

  • Acceleration range: ±2/±4/±8/±16 g
  • Angular rate range: ±125/±245/±500/±1000/±2000 dps
  • Dedicated low noise, low latency signal processing path for stabilization control loop
  • Embedded 4-Kbyte FIFO and smart functions
  • Noise density (accel.): 90 µg/√Hz
  • Rate noise (gyro.): 3.8 mdps/√Hz
  • Embedded sensor hub
  • I2C/SPI digital interfaces
  • Temperature range: -40 to + 85 °C
  • LGA-14 package (2.5 x 3 x 0.83 mm)

Applications

  • Industrial IoT and connected devices
  • Antennas, platforms and optical image and lens stabilization
  • Robotics, drones and industrial automation
  • Navigation systems and telematics
  • Vibration monitoring and compensation

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STMicroelectronics

ISM330DLC

iNEMO® 6-axis system-in-package with high accuracy and ultra-low power for Industry 4.0

ST ISM330DLC

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