Toshiba TLP2768A high-speed IC coupler in SO6L package
TLP2768A ultra-thin photocoupler in SO6L package delivers creepage and clearance distance of 8 mm and isolation voltage of 5000 Vrms
Ultra-thin photocoupler in SO6L package delivers creepage and clearance distance of 8 mm and isolation voltage of 5000 Vrms.
Toshiba has launched a new photocoupler featuring high speed data transmission (20 Mbps) and a very thin package that offers protection against extreme operating temperatures. The TLP2768A is ideally suited for use in high-speed communication interfaces for industrial automation.
Contained within a new SO6L package, which guarantees a clearance and creepage distance of 8mm, the TLP2768A also offers a maximum height of just 2.3 mm, which means a thickness reduction of approximately 45%, when compared to the previous SDIP6 package. With an operating temperature range of -40° C to 125° C, the TLP2768A meets the demand for devices to be used in increasingly compact industrial equipment that contains a greater density of components and therefore has higher internal temperatures.
The TLP2768A integrates a high-reliability infrared LED in its input side, and has an open-collector output type high-speed Photo-IC in its output side that is capable of data transmission at 20 Mbps and of supporting both 3.3 V and 5 V power supplies. The SO6L package just measures 10 mm x 3.8 mm x 2.1 mm.
- Inverter logic type (open collector output)
- Package: SO6L
- Operating temperature: -40° C to 125° C
- Data transfer rate: 20 MBd (typ.) (NRZ)
- Threshold input current: 5.0 mA (max)
- Supply current: 4 mA (max)
- Common-mode transient immunity: ±20 kV/μs (min)
- Isolation voltage: 5000 Vrms (min)
- All Major Safety standards available
- Factory Networking
- High-Speed Digital Interfacing for Instrumentation and Control Devices
- I/O Interface Boards
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