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Toshiba TLP2768A high-speed IC coupler in SO6L package

TLP2768A ultra-thin photocoupler in SO6L package delivers creepage and clearance distance of 8 mm and isolation voltage of 5000 Vrms

Toshiba TLP2768A HIGH-SPEED IC COUPLER product image

Ultra-thin photocoupler in SO6L package delivers creepage and clearance distance of 8 mm and isolation voltage of 5000 Vrms.

Toshiba has launched a new photocoupler featuring high speed data transmission (20 Mbps) and a very thin package that offers protection against extreme operating temperatures. The TLP2768A is ideally suited for use in high-speed communication interfaces for industrial automation.

Contained within a new SO6L package, which guarantees a clearance and creepage distance of 8mm, the TLP2768A also offers a maximum height of just 2.3 mm, which means a thickness reduction of approximately 45%, when compared to the previous SDIP6 package. With an operating temperature range of -40° C to 125° C, the TLP2768A meets the demand for devices to be used in increasingly compact industrial equipment that contains a greater density of components and therefore has higher internal temperatures.

The TLP2768A integrates a high-reliability infrared LED in its input side, and has an open-collector output type high-speed Photo-IC in its output side that is capable of data transmission at 20 Mbps and of supporting both 3.3 V and 5 V power supplies. The SO6L package just measures 10 mm x 3.8 mm x 2.1 mm.

 

Features

  • Inverter logic type (open collector output) 
  • Package: SO6L 
  • Operating temperature: -40° C to 125° C
  • Data transfer rate: 20 MBd (typ.) (NRZ)
  • Threshold input current: 5.0 mA (max) 
  • Supply current: 4 mA (max) 
  • Common-mode transient immunity: ±20 kV/μs (min) 
  • Isolation voltage: 5000 Vrms (min) 
  • All Major Safety standards available

 

Applications

  • Factory Networking
  • High-Speed Digital Interfacing for Instrumentation and Control Devices
  • I/O Interface Boards

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