New Product Introduction

Nexperia Automotive MOSFETs in LFPAK33 trench 6 portfolio

The LFPAK33 is the ultimate in automotive MOSFET performance within a compact power footprint.

Nexperia Automotive MOSFETs in LFPAK33 NPI product image

Bringing Nexperia’s robust and reliable copper clip technology to the Power33 (3.3 mm x 3.3 mm) footprint.

The LFPAK33 is the ultimate in automotive MOSFET performance within a compact power footprint. It  is an extension of the LFPAK family into smaller power systems.

The LFPAK33 uses advanced copper clip technology and its portfolio can address a wide range of automotive applications.

The LFPAK33 supports easy optical inspection and enhanced board level reliability.

The LFPAK33 is footprint compatible with alternative packages in the power33 footprint

 

Key features

  • Ultra-compact footprint – 10.9 mm²
  • Thermal performance – no wires, no glue, 175° C Tj max
  • Electrical performance low pack. resistance and inductance
  • Mechanical robustness

 

Additional features

  • Ultra-compact footprint – 10.9 mm²
  • Thermal performance – no wires, no glue, 175° C Tj max
  • Electrical performance – low package resistance and inductance, up to 70 A ID max rating
  • Mechanical robustness – Exposed leads absorb thermal and mechanical stresses
  • Manufacturability – Exposed leads allows for easy optical inspection

 

Applications

  • Braking (ABS / ESP)
  • Engine management
  • Transmission
  • Automotive lighting
  • Water pump
  • Oil pump
  • Fuel pump
  • Electric park brake

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