New Product Introduction

Infineon Eco Block modules in solder bond technology

Solder bond modules are ideal for applications where the high robustness of pressure contact technology is not necessarily a must.

Infineon® Eco Block modules product image

Infineon Technologies Bipolar extended their Eco Line with 34 mm and 50 mm TT and TD modules in 1800 V – additionally to the 1600 V portfolio.

Solder bond modules are ideal for applications where the high robustness of pressure contact technology is not necessarily a must. Typical applications are drives, power supplies, UPS and welding.

 

Key features

  • Cost effective solution for higher competitiveness
  • Predictably high performance and lifetime due to 100% x-ray
  • Solid base plate for fast and easy mounting
  • One-stop-shop due to complete module technology portfolio

 

Additional features

  • Current 160 A – 320 A
  • Blocking Voltages: 1800 V
  • Industrial standard package
  • Electrically insulated copper base plate

 

Applications

  • Input Rectifier for Drives
  • Low and Medium Voltage Soft Starter
  • Input Rectifier and Bypass for UPS
  • Static Switch

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