TI Internet of Things Overview
Analysts estimate that 50 billion devices will get connected to the Internet by 2020. In this exploding Internet of Things (IoT), users, things and cloud services connect using the Internet to enable new use cases and new business models across multiple markets and applications. Texas Instruments is the only semiconductor company with all of the building blocks to enable the IoT.
Sub-1 GHz CC1120-CC1190 BoosterPack™ Reference Design for the SIGFOX Network
The Sub-1 GHz CC1120-CC1190 BoosterPack™ for the SIGFOX network is a certified hardware design to enable users to connect to the SIGFOX Low Power Wireless Area Network (LPWAN) platform targeted for the Internet of Things (IoT) market.
The CC1120-CC1190 BoosterPack™ is designed for use with the ultra-low-power MSP-EXP430F5529 LaunchPad™ development kits as well as working as a stand-alone module by using SmartRF™ Studio application software. The CC1120-CC1190 BoosterPack is equipped with an integrated PCB trace antenna, which operates in the US 902-928 MHz and European 869-870 MHz ISM frequency bands.
SimpleLink™ Sub-1 GHz CC1310 Wireless Microcontroller (MCU) LaunchPad™ Development Kit
The SimpleLink™ Sub-1 GHz CC1310 wireless microcontroller (MCU) LaunchPad™ development kit is the first LaunchPad kit with a Sub-1 GHz radio, which offers long-range connectivity, combined with a 32-bit ARM® Cortex®-M3 processor on a single chip.
The CC1310 device is a wireless MCU targeting low-power, long-range wireless applications. The CC1310 wireless MCU contains a 32-bit ARM Cortex-M3 processor that runs at 48 MHz as the main processor and a rich peripheral feature set that includes a unique ultra-low power sensor controller. This sensor controller is ideal for interfacing external sensors and for collecting analog and digital data autonomously while the rest of the system is in sleep mode.
New Solutions for Pure Sensing Webinar
This technical session is packed with demos and real-world applications along with the theoretical background which is essential to solve the given problems. Firstly, we will discuss TI's substantial inductive sensing (LDC) portfolio which allows for innovative solutions to existing problems such as touch-on-metal keypads, rotational encoders, and flow meters. Next, an unprecedented approach to capacitive sensing (FDC2x) that enables noise-immune and robust proximity detection applications will be discussed in more detail. Finally TI's Humidity Sensing portfolio will be discussed. Demos will include:
- Touch on metal keypads
- ncremental and absolute encoders
- Event counting based speed measurement
- Proximity detection
Understanding Wireless Connectivity
Written by TI's team of experts, Understanding Wireless Connectivity in the Industrial IoT is an e-book that covers wireless connectivity as it applies to the industrial landscape. This compilation of industrial-focused TI Design reference designs, blog posts, detailed product overviews and a white paper will help developers discover new ways to increase efficiency and productivity, cut costs and better control processes and end equipment. Explore a new chapter of wireless connectivity in the industrial space today.