Samtec Products for FPGA & SoC

Today's designs using FPGA/SoC technology demand high speed, high density interconnects to match the processing, I/O and memory associated with these leading edge applications. Samtec delivers a broad range of innovative connectors and cable assemblies that consistently optimize overall system performance. 

HS Board Connectors

Samtec offers a comprehensive portfolio of high speed board-to-board connectors that complement FPGA/SoC-based systems. Samtec's board-to-board connector solutions support various high speed, high density, rugged and isolation applications. Samtec's Mezzanine Strips feature integral ground planes, ruggedized contact systems, slim bodies and a number of low profile stacking heights. Our Rugged High Speed Strips offer increased insertion depths and rugged designs for contact protection during mating and unmating.

Samtec continually offers new board-to-board connector solutions to meet the unique needs of FPGA/SoC designers. High density arrays offer a variety of pitches, stack heights and configurations allowing for maximum routing, grounding and design flexibility. Newer backplane solutions enable FPGA/SoC designers to optimize signal density in linecard applications while providing a path to 28Gbps and beyond. Whether conforming to industry standards or providing application specific solutions, a growing number of Samtec board-to-board connector solutions are found in modern FPGA/SoC systems.

FMC Standard Connectors

The VITA 57 Field Programmable Mezzanine Card (FMC) standard specifies Samtec’s SEARAY™ connector set. The VITA 57 SEAM/SEAF Series system provides two options: High Pin Count (HPC) or Low Pin Count (LPC).

  • HPC offers 400 I/Os in a 40 x 10 configuration
  • LPC offers 160 I/Os in a selectively loaded 40 x 10 configuration
  • Both LPC and HPC options cope in 8.5 mm and 10 mm stack heights
 

FPGA Baseboard Side Connector Options

Part Numbers

 

Mezzanine Card Side Connector Options

Part Numbers

  • ASP-134488-01: FMC Connector, lead free, (HPC), 400 I/O, male, 10 mm
  • ASP-134602-01: FMC Connector, lead free, (HPC), 400 I/O, male, 8.50 mm
  • ASP-134604-01: FMC Connector, lead free, (LPC), 160 I/O, male, 10 mm
  • ASP-134606-01: FMC Connector, lead free, (LPC), 160 I/O, male, 8.50 mm
 

Q STRIP® High Speed Ground Plane Terminal and Socket Strips (QTE/QSE series)

Samtec Q Strip® connectors are designed for high speed board-to-board applications where signal integrity is essential. They have surface mount signal contacts and ground planes for improved electrical performance.

Q STRIP® Products:

 

Edge Rate® Rugged High Speed Terminal and Socket Strips (ERM8/ERF8 series)

Rugged Edge Rate® contact systems optimized for signal integrity performance in high speed, high cycle applications. The smooth, milled surface of the Edge Rate® contact reduces wear tracks while increasing durability and cycle count.. It also lowers insertion and withdrawal forces allowing the connectors to be zippered when unmating.

Edge Rate® Rugged products

 

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Seaf, Seam & Sear Resources:

 

QSTRIP Resources:

 

Edge Rate Rugged Resources:

 

HS Edge Card Connectors

Samtec's high speed edge card interconnects features rugged Edge Rate™ contacts as well as a variety of orientations. They are designed for high speed, high cycle applications. The surface of the Edge Rate® contact is milled creating a smooth mating surface area instead of a stamped contact that mates on a cut edge. This smooth mating surface reduces the wear tracks on the contact increasing the durability and cycle life of the contact system. It also lowers insertion and withdrawal forces allowing the connectors to be zippered when unmating.

T- 0.80 mm Edge Rate® High Speed Edge Card Connector, Vertical, Edge Mount and Right Angle (HSEC8 Series)
Samtec's high speed edge card interconnects features rugged Edge Rate™ contacts as well as a variety of orientations. They are designed for high speed, high cycle applications. It also lowers insertion and withdrawal forces allowing the connectors to be zippered when unmating

Features:

  • Performance up to 18.5 GHz / 37 Gbps (HSEC-RA)
  • Rugged Edge Rate® contact
  • Single-ended and differential pairs
  • Card slot: .062" (1.60 mm)
  • Optional board locks and cable latching features (HSEC8-DV and HSEC8-RA)
  • Optional weld tab for mechanical strength (HSEC-DV)
  • Solder tabs for mechanical strength.
  • Extended Life Product™ (E.L.P.™).
 

Edge Rate® High Speed

 

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Edge Rate® High Speed:

 

HS Cable Assemblies

As a vertically integrated cable assembly manufacturer, Samtec offers FPGA/SoC designers standard or custom copper and optical cable assembles that complement their designs. The combination of Samtec's in-house design capabilities and customer service enables predictable lead times, high quality product, optimized performance and unparalleled pricing and delivery. In collaboration with FPGA/SoC suppliers, Samtec now provides several cable assembly solutions used extensively in FPGAs/SoC systems

BULLS EYE® High Performance Test Solutions

Samtec’s BullsEye™ test point system is a low cost, high performance test point system that eliminates the need for expensive SMA connectors on production boards. BullsEye™ is a high density array that provides up to 4X the high bandwidth signals in the same real estate, allowing for a smaller board and fewer layers. The system is available in single or multi-port designs, or as a high-density ganged connector.

BULLS EYE®

 

FMC Cable Assemblies

In addition to FMC Standard Connectors, cables assemblies are becoming a popular option for connecting FMC-enabled solutions together. Several options supporting both HPC and LPC versions are available from Samtec.

 

Videos

 

Resources:

Edge Rate® High Speed:

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Samtec

Interconnect Products

High speed, high density interconnect solutions to match the processing, I/O and memory associated with FPGA/SoC based designs.

FPGA solutions

The field-programmable gate array (FPGA) as a primary processing element offers many design, debug, and production benefits.