Aavid Thermal Products: FPGA & SOC

Aavid heat sinks and fansThermal management is crucial to the life and performance of your FPGA and the end product. As the world leader in cooling solutions, Aavid has decades of thermal engineering expertise that enable multiple cost effective, high performing solutions and options to meet your unique thermal challenges.

Aavid is a one-stop-shop for all thermal needs from interface materials and attachments to custom integrated solutions. Aavid Engineers consistently collaborate with manufacturers and customer engineering teams to develop a full understanding of the product and industry requirements.

This wealth of experience combined with Aavid’s unique manufacturing and engineering capabilities is reflected in the quality, availability, and breadth of Aavid’s product catalog. Aavid can offer multiple options for any requirements.

Aavid thermal management solutions for FPGAs and SoCs include:

  • FPGA/BGA Heat Sinks
  • FPGA/BGA Heat Sink & Fan Combinations
  • Heat Pipe Assemblies
  • Liquid Cooling

Finding Your Solution

Aavid cooling offerings will work with any type or brand of FPGA as long as you match the correct system requirements with the thermal technology. Due to the number of options and combinations, Aavid recommends that you fill out the FPGA Solution Questionnaire as thoroughly as possible to be able to match solutions to your needs.

Key factors to choosing or creating the proper solution:

  • Power Levels/ Watts
  • Available Space / Solution Size Requirements
  • Attachment Type
  • Forced or Natural Convection


  1. Provide a data sheet, if possible. At a minimum, provide the footprint. 
  2. What are the size constraints for the heat sink (Maximum in mm)?  
  3. Where will the device be located on the heat sink base? Please provide a sketch if available.
  4. How much power (Watts) will be dissipated from the device? 
  5.  Describe the ambient conditions: 
    1. Are you open to use a fan for cooling? If so, what is the air velocity (CFM)? 
    2. Will the heat sink be fully ducted (no extra space between the heat sink edges and the duct)? If not, please describe.
    3. If you do not plan on using a fan, what will the orientation of the heat sink be with respect to gravity? 
  6. What is the maximum allowable case temperature of the device? NOTE: If you do not specify a max case temp, then the heat sink will be designed around the max junction temp listed on the data sheet.
  7. Does the device need to be electrically isolated from the heat sink? If so, what dielectric strength is required?
  8. What will be used as the interface material between the device and heat sink?NOTE: Aavid can recommend and include an interface material as part of the completed assembly
  9. What is the preferred method of mounting the device to the heat sink?EXAMPLES: double sided tape, PCB attach, attach to device etc…
  10. What finish do you need on the heat sink?

Download a copy of Finding Your FPGA Thermal Solution Questionnaire here.

FPGA/BGA Heat Sink

FPGA/BGA Heat Sinks

Most Common FPGA/ BGA Fin Types:

FPGA/BGA Heat Sinks are typically chosen based on size, fin type, and attachment such as solder anchor, tape, or clip on. Active solutions with Aavid fans are also available with any standard or custom components.

  • Pin Fin (or Cross Cut)
  • Skived
  • Extruded

Most Common FPGA/ BGA Attachment Types:

  • Push Pin
  • Solder Anchor
  • Clip On
  • Tape

The table below contains examples of each and Aavid’s most popular standard solutions.

Focus Product, EA Series Clip Attach Features:

  • 2.5mm keep out zone for high density PCB layout
  • Force applied by flexible wire spring
  • No short-circuit concern from UL94V-0 rated PA66
  • Easy mounting
  • Re-workable
  • Shock & Vibration tested Cost Effective

Resource Documents:


Heat Pipe Assemblies

Aavid is a world leader for heat pipe technology and design for extremely efficient passive cooling.

Heat pipes have many advantages and applications in thermal solutions. Heat pipes transport significant amounts of heat without a large increase in temperature, but do not dissipate any heat out of the system by themselves.

This unique transfer capability allows heat pipes to transport or spread heat to a point remote from the heat generator. Integrating a heat pipe into a system can open new thermal solutions to systems with high density power loads, enclosed or limited space, weight restrictions, or limited airflow.

The availability of a wide range of heat pipes sizes and power handling capabilities make them suitable for integration in heat sinks for 50W processors to multi kilowatt IGBTs.

Resource Documents:


Liquid Cooling

Aavid Water Cooling PlateFPGA/BGA Heat Sinks are typically chosen based on size, fin type, and attachment such as solder anchor, tape, or clip on. Active solutions with Aavid fans are also available with any standard or custom components.

Optimize Liquid Contact with Hot Surfaces
Liquid cooling manages the heat loads of high watt density applications across all industries. Liquid Cold Plates are the most effective way to optimize liquid contact with hot surfaces and have the highest heat transfer. Aavid uses cutting edge technologies and offers the widest most innovative line of cold plate products from standard to fully customized solutions.

Features & Benefits:

  • Cost Effective
  • High Performance Leak Free Joints
  • Hi‐Contact™ for Better Heat Transfer
  • Easy to Customize

Resource Documents:

Aavid Resource Document

Thinking Ahead Thermally

A guide to designing your board to avoid thermal mistakes.