Inspiring innovation in Defense and Aerospace technology

For over 100 years, ITT Cannon has designed interconnect solutions to keep soldiers safe on land, in the air, at sea and in space. From the invention of rack-and-panel and D-subminiature to the latest fiber-optic and miniaturized connectors, our brands have been synonymous with innovation, reliability and quality.

Whether we are providing critical power in armored vehicles or a lightweight, reliable interconnect solution for soldier wearables, ITT Cannon offers highly engineered solutions for your harsh environments.

Featured products/Resources

High-Density, Miniature Circular Interconnects

ITT’s KP Series feature a positive three-point bayonet coupling, five-keyway polarization and high insert arrangements. From the high-performance KPSE, with crimp contacts and a clip in retention system for fast and simple assembly, to KPT with pre-installed and glued solder contacts, the KP range can meet the widest range of requirements.

Available in 10 shells sizes, with 40 layouts ranging from 2 to 61 contacts; this series is fully interchangeable and intermateable with connectors qualified and designed to MIL-DTL-26482 and VG95328.

Search parts: KPT00 | KPT02 | KPT05 | KPT06 | KPSE05 | KPSE06

ITT Cannon's KP Series of miniature circular interconnects


Resources:

ITT Cannon KPT KPSE 26482 Sell Sheet

ITT Cannon KPx2 Sell Sheet

High Performance. High Density. Environmentally Sealed.

Originally designed & patented by ITT Cannon engineers for use on commercial & military aviation systems, D-Sub Connectors were manufactured as a smaller, lightweight alternative to many of the large, heavier circular electronic plugs of the time. This small but robust rectangular interconnect solution was quickly adopted across a number of applications and industries, and the Cannon D-Sub soon became the first multi-purpose connector of its kind.

Today, we offer a wide array of standard, high density, double density & Combo-D layouts with crimp, solder, PCB or wire wrapped termination. Select parts are qualified to NASA, MIL-DTL-24308 & SAE Standards.

Search parts: DEMM | DEU | DCM | DEMA

ITT Cannon's D-Sub connector series


Resources:

D-Sub Product Selection Guide

MIL-DTL-24308 Sell Sheet

Miniaturized Connectors that you can trust

ITT Cannon’s Micro-D Series is ideally suited for applications requiring extremely small, lightweight and ruggedized solutions with higher density contact configurations. They are available in eight shell sizes that accommodate from 9 to 100 contacts. These robust, space-saving connectors meet ongoing industry demand for environmental, high performance and moisture sealing in the harshest environments.

Cannon’s MIL-DTL-83513 and MDM configurations include wired pigtail, solder cup, right angle, condensed right angle and straight PC tail layouts and utilize ITT’s reliable, high performance Twist Pin Contact system.

Search parts: MDM9 | MDM15 | MDM25 | MDM51 | MDM100

ITT Cannon's Micro-D MDM miniaturized connectors series


Resources:

Micro Catalog

MIL-DTL-83513 Sells Sheet

High Temperature Micro Brochure

The next generation of miniature circular connectors for soldier wearables

The innovative Nemesis connector series features versatile pogo pad configurations in a miniaturized, weight saving design. From our low profile, Nemesis Space Saver to our Cannon Break Away (CBA), the Nemesis portfolio helps soldiers reduce physical load, improve mobility, maintain communication and receive mission-critical information when they need it most.

Search parts: NEM

ITT Cannon's Nemesis miniature circular connectors for soldier wearables


Resources:

Mini Circular Series Catalog

Guide

From rocket launchers and telecommunications, to avionics and high-speed rail, its performance, reliability and versatility ITT Cannon’s D-Subminiature is one of the most widely used connectors in the world.

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Catalog

Microminiature Interconnect Solutions Ultra lightweight, space-saving connectors and cable assemblies for unmatched performance & reliability in the harshest environments

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