Teledyne e2v QorIQ® Layerscape LS1046A multicore processor
Teledyne e2v’s military qualified version of NXP’s LS1046A processor, guarantees its operation at -55°C to 125°C for Aerospace and Defence Applications.
Teledyne e2v has qualified and released the first upscreened processor from NXP’s new Layerscape® Series, the LS1046A, to operate at -55°C to 125°C. The LS1046A is part of NXP’s 64-bit Arm® Layerscape portfolio that, implements a quad-core Arm® Cortex® A72 design providing unparalleled performance in the smallest form factor possible while enabling access to the vast ecosystem of software services, applications and tools compatible with Arm® technology.
The LS1046A from NXP is a 1.8GHz processor integrating packet processing acceleration with high-speed peripherals and is recognized for its high-performance architecture and market-leading compute density. The LS1046A, offering more than 45,000 CoreMarks® of compute performance, paired with dual 10Gb Ethernet, PCIe Gen3, SATA Gen3 is suitable for a range of high reliability mil-aero applications. The Teledyne e2v military qualification of this device assures its functionality between -55°C and 125°C and is available in both RoHS and leaded packages. In addition, as part of Teledyne e2v’s Semiconductor Lifecycle Management program, SLiM™, the lifetime of this device can be supported for 15+ years, avoiding common and costly obsolescence issues.
Teledyne e2v is now offering a broad range of devices to its Aerospace & Defense customers; its portfolio includes many PowerPC®-based qualified and supported processors from the NXP QorIQ® P- and T-Series, as well as the more traditional PowerQUICC® devices. Customers can continue using their Power Architecture-based software and applications, while Teledyne e2v continues to develop solutions on newer technologies such as Arm®-based solutions from NXP. Customers may either transition to Arm®-based solutions or start new developments with proven Power® Architecture-based solutions from NXP. The LS1046A is also the chosen device to be embedded into Teledyne e2v’s latest Qormino® computing module, which also includes a 4GB DDR4 memory (for more information, please check: www.teledyne-e2v.com/products/semiconductors/qormino).