NXP LPC804 Series MCUs
LPC804 - NXP entry-level 32-bit Arm®Cortex®-M0+ based microcontroller units at the right price
NXP’s LPC800 series MCUs offer a range of low-power, space efficient, low-pin-count options for basic microcontroller applications.
LPC804, the newest addition to the LPC800 series, is a cost-effective 32-bit Arm®Cortex®-M0+ based MCU upgrade solution to applications that used to work with 8-bit MCUs.
LPC804 is a cost-effective Arm® Cortex®-M0+ based 32-bit MCU family operating at CPU frequencies of up to 15 MHz, supporting 32 KB of EEPROM-based flash memory and 4 KB of SRAM. This family features a power optimized core, small footprint in popular packages, and level shifting options thanks to its separate power rails. The peripheral complement of the LPC804 includes a CRC engine, I2C-bus interfaces, up to two USARTs, one SPI interface, capacitive touch interface (cap touch), one multi-rate timer, self-wake-up timer, one general purpose 32-bit counter/ timer, one 12-bit ADC, one 10-bit DAC, one analog comparator, function-configurable I/O ports through a switch matrix, an input pattern match engine, programmable logic unit (PLU), and up to 30 general-purpose I/O pins.
- Sensor gateways
- Simple motor control
- Portables and wearables
- Gaming controllers
- 8/16-bit applications
- Motor control
- Fire and security applications
- Climate control
Development tools and ecosystem
OM40001UL – LPCXpresso804 Development Kit
The LPCXpresso804 board enables easy evaluation of the LPC804 MCU, including capacitive touch capabilities and the Programmable Logic Unit (PLU).
Integrated Development Environments (IDE)
- MCUXpresso IDE
- IAR® Embedded Workbench
- Arm® KEIL® MDK
|Type number||Package name||Description||Version|
|LPC804M101JDH20||TSSOP20||Plastic thin shrink small outline package; 20 leads; body width 4.4 mm||SOT360-1|
|LPC804M101JDH24||TSSOP24||Plastic thin shrink small outline package; 24 leads; body width 4.4 mm||SOT355-1|
|LPC804M111JDH24||TSSOP24||Plastic thin shrink small outline package; 24 leads; body width 4.4 mm||SOT355-1|
|LPC804M101JHI33||HVQFN33||HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5 x 5 x 0.85 mm, 33 terminals; body 5 x 5 x 0.85 mm||SOT617-11|
|Type number||Flash/KB||SRAM/KB||USART||I2C||SPI||DAC||Capacitive Touch||PLU||GPIO||Dual I/O power supply||Package|
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