SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer module definition targeting applications that require low power, low costs, and high performance.

The new MSC SM2F-AL module features Intel's next-generation low-power System-on-Chip (SOC) for the Internet of Things. The Intel Atom Processor E3900 series integrates processor core, graphics, memory, and I/O interfaces into one solution and provides considerably higher graphics and computing performance compared to its predecessors. MSC SM2F-AL offers triple independent display support, DirectX 12, fast DDR3L-1866 memory, eMMC and SATA Flash, USB 3.0 and a on-board Wireless Module integrated on a power saving and cost-efficient SMARC 2.0 Full Size module.

 

The design of the MSC SM2S-IMX6 module is based on NXP’s i.MX 6 processors offering quad-, dual- and single-core ARM® Cortex™-A9 compute performance at very low power consumption and excellent graphics performance combined with a high degree of functional integration.

MSC SM2S-IMX6It incorporates the i.MX 6 (Solo, DualLite, Dual or Quad) or the i.MX 6DualPlus or 6QuadPlus processor with up to 1.2 GHz, up to 4GB DDR3L SDRAM and up to 64GB eMMC Flash memory as well as an extensive set of interface controllers. The module is compliant with the new SMARC™ 2.0 standard, allowing easy integration with SMARC™ baseboards.

For evaluation and design-in of the SM2S-IMX6 module, MSC provides a development platform and a starter kit. Support for Linux and Windows Embedded Compact 7 and 2013 is available (Android on request).


 

Key Specifications:

  • NXP™ i.MX 6 ARM® Cortex™-A9 Solo, DualLite, Dual, Quad, DualPlus and QuadPlus processor
  • MPEG-4 Video Encoding/Decoding 1080p
  • HDMI graphics 1920 x 1080 x 30fps
  • Dual-channel LVDS 1920 x 1080 x 30fps
  • Up to 4GB DDR3L SDRAM
  • Up to 64GB eMMC Flash
  • Gigabit Ethernet Interface
  • 1x PCI Express x1
  • 1x SATA-II (3Gbps, quad-/dual-core only)
  • 1x USB Device/Host + up to 5x USB 2.0
  • 1x MMC/SD/SDIO Interface
  • 2x CAN Interface
  • I2S Audio Interface
  • MIPI CSI-2 Camera Interface
  • Micro SD Card Socket
  • SMARC™ 2.0 Compliant

The new MSC SM2S-IMX8M module features NXP’s i.MX8M processors offering dual- and quad-core ARM Cortex-A53 compute performance at very low power consumption and excellent graphics performance combined with a high degree of functional integration.

MSC SM2S-IMX8MBuilt with best in class audio, voice and video processing technology, the NXP i.MX8M Family of Applications Processors is ideally suited for Media IOT and industrial applications such as Video, Voice and Audio for Connected Devices, Smart Home as well as HMI, Voice and Vision for harsh environments.

MSC SM2S-IMX8M offers dual-core or quad-core ARM Cortex-A53 processors in combination with ARM Cortex-M4 real time processor and Vivante GC7000Lite 3D Graphics GPU. It provides fast LPDDR4 memory, up to 64GB eMMC Flash memory, Gigabit Ethernet, PCI Express, USB 3.0, an on-board Wireless Module as well as an extensive set of interfaces for embedded applications.

The module is compliant with the new SMARC™ 2.0 standard, allowing easy integration with SMARC baseboards. For evaluation and design-in of the SM2S-ZUSP module, MSC provides a development platform and a starter kit. Support for Linux is available (Android support on request).

Key Specifications:

  • Dual or Quad core NXP i.MX8M ARM Cortex-A53 Applications Processor up to 1.5GHz
  • ARM Cortex-M4 Real Time Processor at 266MHz
  • Vivante GC7000Lite 3D Graphics Processor
  • 4Kp60 HEVC/H.265, H.264 and VP9 Video Codec (not supported by 8MQuadLite)
  • Up to 4GB LPDDR4 SDRAM
  • Up to 64GB eMMC Flash
  • Dual-channel LVDS / MIPI-DSI (optional)
  • HDMI 2.0 / DisplayPort interface (optional)
  • Dual Independent Display support
  • Dual MIPI CSI-2 Camera Interface
  • 2x PCI Express x1 Gen. 2
  • 2x USB 3.0 Host interface
  • 2x USB 2.0 Host interface
  • 1x USB 2.0 Host/Device interface
  • Gigabit Ethernet
  • Wireless Module (optional)
  • MMC/SD/SDIO interface
  • 2x CAN interface (optional)
  • 2x I2S Audio Interface
  • UART, SPI, I2C
  • SMARC 2.0 Compliant

The MSC SM2S-ZUSP module is based on Xilinx Zynq UltraScale+ MPSoC and supports ZU2, ZU3, ZU4 or ZU5 FPGA complexity.

MSC SM2S-ZUSPZynq UltraScale+ MPSoC devices provide 64-bit processor scalability while combining real-time control with soft and hard engines for graphics, video, waveform, and packet processing. Integrating an ARM®-based system for advanced analytics and on-chip programmable logic for task acceleration creates unlimited possibilities for applications including 5G Wireless, next generation ADAS, Internet-of-Things, Industrial Automation, Medical, Transportation and Robotics

MSC SM2S-ZUSP offers dual-core or quad-core ARM Cortex™-A53 processors in combination with dual ARM Cortex-R5 real time processors and ARM Mali™-400 GPU. It provides DDR4 SDRAM with optional ECC, dedicated DDR4 SDRAM for the Programmable Logic, up to 64GB eMMC Flash memory, Dual Gigabit Ethernet, PCI Express, USB 3.0, an on-board Wireless Module as well as an extensive set of interfaces for embedded applications.

The module is compliant with the new SMARC™ 2.0 standard, allowing easy integration with SMARC baseboards. For evaluation and design-in of the SM2S-ZUSP module, MSC provides a development platform and a starter kit. Support for Linux is available (Android support on request).
 

Key Specifications:

  • Dual or Quad core ARM Cortex-A53 Application Processors up to 1.5GHz
  • Dual core ARM Cortex-R5 Real-Time Processors up to 600MHz
  • Mali-400 MP2 Graphics Processor (optional)
  • H.264 / H.265 Video Codec (optional)
  • Up to 8GB DDR4 SDRAM, ECC support (optional)
  • Up to 2GB DDR4 SDRAM for FPGA (optional)
  • Up to 64GB eMMC Flash
  • SATA-III interface (6Gbps)
  • Dual-channel LVDS interface
  • DisplayPort interface
  • Up to 2x PCI Express x2 Gen. 3
  • 1x USB 3.0 Host interface
  • 2x USB 2.0 Host interface
  • 1x USB 2.0 Host/Device interface
  • Gigabit Ethernet (single or dual)
  • Wireless Module (optional)
  • 1x MMC/SD/SDIO interface
  • UART, SPI, I2C
  • Rich FPGA I/O
  • SMARC 2.0 Compliant

The new MSC SM2S-AL module features Intel's next-generation low-power System-on-Chip (SOC) for the Internet of Things. The Intel Atom Processor E3900 series integrates processor core, graphics, memory, and I/O interfaces into one solution. Based on 14nm processor technology this multi-core processor provides outstanding computing and graphics performance and is more power efficient compared to its predecessors. 

MSC SM2S-ALThe new MSC SM2S-AL offers triple independent display support, DirectX 12, fast LPDDR4 memory, eMMC and USB 3.0 on a power saving and cost-efficient SMARC 2.0 Short Size module. 

Different SOCs with dual- and quad-core processors are supported by this design. In addition to an extensive set of interfaces and features, the MSC SM2S-AL optionally offers hardware based security compliant to the requirements of TCG (Trusted Computing Group). 

For evaluation and design-in of the MSC SM2S-AL module, MSC provides a suitable SMARC 2.0 development platform. A complete, ready-to-run Starterkit is also available.

 

Key specifications:

  • Intel Atom x7-E3950 quad-core 1.6/2.0GHz, 12W
  • Intel Atom x5-E3940 quad-core 1.6/1.8GHz, 9.5W
  • Intel Atom x5-E3930 dual-core 1.3/1.8GHz, 6.5W
  • Intel Pentium N4200 quad-core 1.1/2.5GHz, 6W
  • Intel Celeron N3350 dual-core 1.1/2.4GHz, 6W
  • Integrated Intel Gen. 9 HD Graphics
  • Up to 8GB LPDDR4 SDRAM
  • Up to 64GB eMMC Flash (optional)
  • SATA-III interface (6Gbps)
  • DisplayPort++ interface
  • LVDS / Embedded DisplayPort interface
  • Triple Independent Display support
  • DirectX 12, OpenGL 4.3, OpenCL 2.0
  • Dual MIPI CSI-2 Camera Interface
  • Up to 4x PCI Express x1 Gen. 2
  • 2x USB 3.0 Host interfaces
  • 5x USB 2.0 Host interfaces
  • 1x USB 2.0 Host/Device interface
  • Gigabit Ethernet
  • UART, LPC, SPI, I2C, SMBus
  • HD/I2S Audio, SD Card interface
  • Trusted Platform Module (optional)
  • SMARC 2.0 compliant
  • UEFI Firmware

Customization

Avnet Integrated offers customization of its standard modules according to the requirements of the customers. This will help to achieve required price points for volume projects by not populating components which are not required, i.e. less memory or less controllers of unnecessary functionality. In addition, Avnet Integrated offers to assemble Computer-on-Modules on carrier boards, optionally with suitable cooling and with memory modules inserted. 

CUSTOMIZED ASSEMBLY – INDIVIDUAL SOLUTIONS

  • Mounted and tested (memory, cooling, baseboard)
  • Individual test profile
  • Pre-configured BIOS
  • Baseboard Electronic Manufacturing Service (EMS)

To find out more about our standard embedded board solutions and how we can design, make, supply and deliver them to suit your manufacturing needs, get in touch with us!

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