Webinar - Nexperia's Application Optimized MOSFET Solutions
30 May 2020 - 01 Aug 2020
Online, On Demand
Online, On Demand
Nexperia’s Application Optimized MOSFET Solutions
The presentation aims at bridging the Si & package level MOSFET optimizations to the circuit level benefits that can be achieved, on the back of these improvements to Si and package technology.
In the first part of the presentation, the attendees will learn about the <=40V and >40V MOSFET technologies of Nexperia and how these are different to the other popular technologies out there, and the benefits that these technologies bring to the applications. This section will also provide a quick glimpse at the Nexperia’s portfolio.
The second part of the presentation offers a different take on the established FOM (figure of merit) concept for the MOSFETs and aims at cautioning the circuit designers against the head line chasing & record breaking obsession of some MOSFET suppliers.
Finally the presentation concludes with the introduction of the latest and the largest LFPAK ( Clip bonded package) in an 8*8 foot print and compares its performance with larger traditional wire bonded packages out there.
- Low voltage MOSFET Si technologies
- How certain MOSFET parameters can assist circuit designer to achieve an enhanced efficiency and reliability
- What parameters to look at, when selecting MOSFETs for various applications
- A view at Nexperia’s Cu clip packages
Siva Uppuluri – Product and Marketing Manager, Nexperia
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