Webinar-Nexperia-Application-Optimized-MOSFET-Solutions | EBV Elektronik

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Webinar - Nexperia's Application Optimized MOSFET Solutions

30 May 2020 - 01 Aug 2020

Online, On Demand

Online, On Demand​

Nexperia’s Application Optimized MOSFET Solutions 


The presentation aims at bridging the Si & package level MOSFET optimizations to the circuit level benefits that can be achieved, on the back of these improvements to Si and package technology. 

In the first part of the presentation, the attendees will learn about the <=40V and >40V MOSFET technologies of Nexperia and how these are different to the other popular technologies out there, and the benefits that these technologies bring to the applications. This section will also provide a quick glimpse at the Nexperia’s portfolio.

The second part of the presentation offers a different take on the established FOM  (figure of merit) concept for the MOSFETs and aims at cautioning the circuit designers against the head line chasing & record breaking obsession of  some MOSFET suppliers.

Finally the presentation concludes with the introduction of the latest and the largest LFPAK ( Clip bonded package) in an 8*8 foot print and compares its performance with larger traditional wire bonded packages out there.


Key Take-Aways:

  • Low voltage MOSFET Si technologies
  • How certain MOSFET parameters can assist circuit designer to achieve an enhanced efficiency and reliability
  • What parameters to look at, when selecting MOSFETs for various applications
  • A view at Nexperia’s Cu clip packages


Related documents:



Siva Uppuluri – Product and Marketing Manager, Nexperia



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Webinar-Nexperia-Application-Optimized-MOSFET-Solutions | EBV Elektronik

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