New Product Introduction

XILINX Virtex UltraScale+ HBM High Performance FPGA®

High Performance FPGA with on-board High Bandwidth Memory

XILINX Virtex UltraScale+ HBM FPGA® product image

Based on the UltraScale architecture, the latest Virtex® UltraScale+ devices provide the highest performance, including the highest signal processing bandwidth at more than 20 TeraMACs of DSP compute performance.

They also deliver the highest on-chip memory density with up to 378 Mb of total on-chip integrated memory, plus up to 8 GB of HBM Gen2 integrated in-package for 460 GB/s of memory bandwidth. Virtex UltraScale+ devices deliver significant capabilities with integrated IP for PCI Express, Interlaken, 100 G Ethernet with FEC, and Cache Coherent Interconnect for Accelerators (CCIX).

 

Features

  • Internal SRAM Bandwidth = 30 TB/s
  • HBM2 Memory Bandwidth = 460 GB/s and DDR Memory Bandwidth = 38 GB/s
  • 24.5 Tera OP/s DSP compute performance
  • Look-Up Tables = 1,079 K PCI Express Gen4 × 8 with CCIX

 

Additional features

  • Integrated 100 G Ethernet MAC with KR4-FEC and 150G Interlaken cores
  • Over 2× system-level performance per watt over Virtex-7 FPGAs
  • Up to four speed-grade improvement with high utilization
  • Up to 128-33 G transceivers deliver 8.4 Tb of serial bandwidth
  • 58 G PAM4 transceivers with KP4-FEC enable data transmission at 50 G+ line rates
  • 460 GB/s HBM bandwidth, and 2,666 Mb/s DDR4 in a mid-speed grade
  • A 5:1 card reduction for 1 Tb MuxSAR transponder
  • UltraRAM for on-chip memory integration
  • VCXO and fractional PLL integration reduces clocking component cost High Performance FPGA with on-board High Bandwidth Memory
  • Internal SRAM Bandwidth = 30 TB/s
  • HBM2 Memory Bandwidth = 460 GB/s and DDR Memory Bandwidth = 38 GB/s
  • 24.5 Tera OP/s DSP compute performance
  • Look-Up Tables = 1,079 K PCI Express Gen4 × 8 with CCIX
  • Up to 60 % lower power vs. 7 series FPGAs
  • Voltage scaling options for performance and power
  • Tighter logic cell packing reduces dynamic power
  • Seamless footprint migration from 20 nm planar to 16 nm FinFET+
  • Co-optimized with Vivado Design Suite for rapid design closure
  • SmartConnect technology for intelligent IP integration
  • Of very high value are the IPs:
  • TCAM SmartCoreTM , a ternary, content-addressable memory
  • Random Forest, provides acceleration, e.g. for implementing machine learning algorithms


Applications

  • AI
  • Wired Comms HBM as a packet buffer (400G+)
  • Data Center Storage Acceleration
  • Smart NIC
  • Machine Learning
  • A&D Any number of radar and electronic warfare applications
  • Algorithmic TCAM Random Forrest

XILINX Virtex UltraScale+ HBM FPGA® | EBV Elektronik

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