New Product Introduction

Nexperia MicroPak space-saving AEC-Q100 logic in XSON packages

As the leader in Mini Logic for Automotive, Nexperia is addressing space constraints in automotive applications with innovative MicroPak solutions that exceed AEC-Q100 requirements

Nexperia MicroPak packages product image

As the leader in Mini Logic for Automotive, Nexperia is addressing space constraints in automotive applications with innovative MicroPak solutions that exceed AEC-Q100 requirements. The Q100 portfolio now includes more than 20 Automotive-qualified functions in XSON leadless extremely-thin small-outline packages. Single-gate and dual-gate functions in LVC (1.65 V to 5.5 V), AUP (0.8 V to 3.6 V) and AVC (1.2 V to 3.6 V) technologies are now available in Automotive-ready XSON6 and XSON8 packages. Functions include buffers/inverters, gates, translators, Schmitt-triggers, transceivers and more.

 

Key features

  • Smallest Automotive-qualified logic
  • 6-pad & 8-pad options (0.5 or 0.35 mm pitch); low package profile height (0.5 or 0.35 mm)
  • Fully specified from -40 to 125 °C
  • RoHS and dark green compliant

 

Additional features

  • Significant space savings (Within the XSON package family, the 6-pad XSON6 (SOT886 & SOT1202), as well as the 8-pad XSON8 (SOT833-1 & SOT1203) can save up to ~60 % PCB space for slimmer and more compact automotive designs)
  • Reliable bond - no bent leads
  • Same silicon die as PicoGate
  • Simplified board layout
  • Low power consumption

 

Applications

  • Automotive space-constrained applications
  • On-board infotainment
  • Instrument cluster & ADAS
  • Body control modules (BCM)
  • Battery management systems (BMS)

Nexperia space-saving AEC-Q100 MicroPak packages | EBV Elektronik

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