New Product Introduction

Infineon Prime Block - solder bond technology

Solder bond modules are ideal for applications where the high robustness of pressure contact technology is not necessarily a must

Infineon Prime block product picture

Infineon Technologies Bipolar extends its product portfolio of thyristor/diode modules in solder bond technology with higher current ratings. The 50 mm Prime Block modules cover now current ratings of 390 A and become best in class. Solder bond modules are ideal for applications where the high robustness of pressure contact technology is not necessarily a must.

 

Key features

  • Optimized thermal design
  • Best in class current rating in 50 mm foot print
  • 50 mm foot print available with TIM
  • Increased power density


Additional features

  • Predictably high performance and lifetime due to 100% x-ray monitoring
  • Solid base plate for fast and easy mounting
  • Optimized for less performant heat sinks

 

Applications

  • Drives
  • Welding
  • UPS

Infineon Prime Block - solder bond technology | EBV Elektronik

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