New Product Introduction

Infineon IM69D XENSIV™ MEMS microphones

IM69D130 is a high performance digital MEMS microphone making use of Infineon’s Dual Backplate MEMS technology

Infineon IM69D product image

EBV presents the XENSIV™ MEMS microphones IM69D130 which is designed for applications where low self-noise (high SNR), wide dynamic range, low distortion and a high acoustic overload point are required.

IM69D130 is a high performance digital MEMS microphone making use of Infineon’s Dual Backplate MEMS technology to deliver 105dB dynamic range and high output linearity up to 130dBSPL. The application benefits are crystal clear audio signals, extended pick-up distance and sensitivity to both soft and loud signals - from whispered speech to rock concerts.

 

Key features

  • Far field and low volume audio pick-up
  • Clear audio signal even at high sound pressure levels
  • Excellent precision of audio beams and algorithms
  • 69 dB(A) signal-to-noise ratio

 

Additional features

  • Below 1 percent distortion up to 128 dBSPL
  • 130 dBSPL acoustic overload point
  • Digital (PDM) interface
  • Tight sensitivity and phase tolerances
  • 4 x 3 x 1.2mm package size

 

Applications

  • Voice User Interface (VUI)
  • Active Noise Cancellation (ANC)
  • High quality audio capturing
  • Audio pattern detect