New Product Introduction

Infineon 650 V ultra-thin TRENCHSTOP™ 5 in D2Pak

The new TRECHSTOP™ 5 IGBT in D2Pak expands the limits of surface mounted devices to the higher power range competing now with D3Pak and through hole TO-247 packages

Infineon 650 V TRENCHSTOP™ 5 in D2Pak product image

Ultra-thin TRENCHSTOP™ 5 IGBT technology from Infineon allows higher power density in smaller chip size. Infineon is the first on the market able to fit 40 A 650 V IGBT with 40A diode in D2Pak package – 25% higher than any other competitor offering maximum 30A Duopack IGBT in D2Pak.

 

The new TRECHSTOP™ 5 IGBT in D2Pak expands the limits of surface mounted devices to the higher power range competing now with D3Pak and through hole TO-247 packages.

 

Key features

  • Highest power density 650V IGBT in D2Pak footprint
  • Unique 40A 650V IGBT Duopack in D2Pak footprint
  • Best-in-class fast speed switching H5 or medium-speed optimized S5 TRENCHSTOP 5 IGBT
  • /

 

Additional features
 

  • Best –in-class fast speed switching H5 or medium-speed optimized S5 TRENCHSTOP™ 5 IGBT technology
  • Higher power design with D2Pak package

     
  • Upgrade of the available designs for higher power output
  • Less paralleling - > higher reliability
  • Smaller PCB, more compact system design, smaller weight

 

Applications

  • Welding
  • UPS
  • Battery Chargers
  • Solar
  • Drives

Infineon 650 V ultra-thin TRENCHSTOP™ 5 in D2Pak | EBV Elektronik

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