Nexperia TRENCH 9 40V – LFPAK56 automotive MOSFETs

Nexperia’s latest automotive Power MOSFET portfolio delivers improved performance and reliability due to our unique combination of Trench 9 superjunction technology, and LFPAK packaging capability

Nexperia’s latest automotive Power MOSFET portfolio delivers improved performance and reliability due to our unique combination of Trench 9 superjunction technology, and LFPAK packaging capability.

• Six Standard level products from 1.4–3.5mΩ
• R_DS(on) capability improved from 3mΩ to 1.4mΩ
• Enhanced I_D max up to 120A

 

Key features

• Improved power density, same footprint, low Rdson (1.4mΩ)
• Improved efficiency and switching performance
• Exceptional repetitive avalanche performance, improved SOA
• Replacement for DPAK and D2PAK, up to 81% space efficiency​

     

Additional features

• Fully automotive qualified to AEC-Q101:
  • 175 °C rating suitable for thermally demanding environments
• Trench 9 Superjunction technology:
  • Reduced cell pitch enables enhanced power density and efficiency with lower RDSon in same footprint
  • Improved SOA and avalanche capability compared to standard TrenchMOS
  • Tight VGS(th) limits enable easy paralleling of MOSFETs
• LFPAK Gull Wing leads:
  • High Board Level Reliability absorbing mechanical stress during thermal cycling, unlike traditional QFN packages
  • Visual (AOI) soldering inspection, no need for expensive x-ray equipment
  • Easy solder wetting for good mechanical solder joint
• LFPAK copper clip technology:
  • Improved reliability, with reduced Rth and RDSon
  • Increases maximum current capability and improved current spreading 
• Enhanced LFPAK56E design allows up to 30% improvement in RDS(on) and power density

 

Applications

• Power train - automotive application
• Connected car