Nexperia TRENCH 9 40V – LFPAK56 automotive MOSFETs
Nexperia’s latest automotive Power MOSFET portfolio delivers improved performance and reliability due to our unique combination of Trench 9 superjunction technology, and LFPAK packaging capability

Nexperia’s latest automotive Power MOSFET portfolio delivers improved performance and reliability due to our unique combination of Trench 9 superjunction technology, and LFPAK packaging capability.
- Six Standard level products from 1.4–3.5mΩ
- RDS(on) capability improved from 3mΩ to 1.4mΩ
- Enhanced ID max up to 120A
Key features
- Improved power density, same footprint, low Rdson (1.4mΩ)
- Improved efficiency and switching performance
- Exceptional repetitive avalanche performance, improved SOA
- Replacement for DPAK and D2PAK, up to 81% space efficiency
Additional features
- Fully automotive qualified to AEC-Q101:
- 175 °C rating suitable for thermally demanding environments
- Trench 9 Superjunction technology:
- Reduced cell pitch enables enhanced power density and efficiency with lower RDSon in same footprint
- Improved SOA and avalanche capability compared to standard TrenchMOS
- Tight VGS(th) limits enable easy paralleling of MOSFETs
- LFPAK Gull Wing leads:
- High Board Level Reliability absorbing mechanical stress during thermal cycling, unlike traditional QFN packages
- Visual (AOI) soldering inspection, no need for expensive x-ray equipment
- Easy solder wetting for good mechanical solder joint
- LFPAK copper clip technology:
- Improved reliability, with reduced Rth and RDSon
- Increases maximum current capability and improved current spreading
- Enhanced LFPAK56E design allows up to 30% improvement in RDS(on) and power density
Applications
- Power train - automotive application
- Connected car
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