New Product Introduction

Infineon BSZ0909ND half-bridge optimized solution

Infineon optimized solution for wireless power, drives and wearables

Infineon BSZ0909ND half-bridge diagram image

EBV presents BSZ0909ND:

Used OptiMOS™ technology combined with the PQFN 3x3 package offers an optimized solution for DC-DC applications with space critical requirements.

Key features

  • Ultra-low Qg
  • Half-bridge in a small 3.0x3.0 mm² package outline
  • Exposed pads
  • Logic level (4.5 V rated)



  • Low switching losses
  • High switching frequency operation
  • Lowest parasitics
  • Low operating temperature
  • Low gate drive losses
  • RoHS 6/6 lead free product


  • Wireless
  • Drives (e.g. Multicopter)

Infineon BSZ0909ND half-bridge optimized solution | EBV Elektronik

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