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CoolSiC™ 1700V SiC Trench MOSFET in TO-263-7 package

 

The CoolSiC™ MOSFET 1700 V in SMD extended creepage package is the best fit device in auxiliary power supply used in three-phase power converters. It gives the best efficiency in a simple single-ended flyback converter, and eliminates design concerns on voltage stress margin and reliability of power supply.

The new 1700V CoolSiC™ trench MOSFETS are optimized for fly-back topologies with +12V/ 0V gate-source voltage compatible with common PWM controllers, no need for a gate driver IC. The new D2PAK-7L package fulfills 1700V safety requirements with > 7mm creepage and clearance distrances, which minmizes isolation effort in the PCB design.


Features

  • Optimized for fly-back topologies
  • Extremely low switching loss
  • 12V / 0V gate-source voltage compatible with fly-back controllers
  • Fully controllable dV/dt for EMI optimization
  • SMD package with enhanced creepage and clearance distances,  7 mm

Target applications

  • Solar inverter
  • Industrial UPS
  • Industrial SMPS
  • EV charger
  • Motor drives


Benefits

  • 1700V SiC MOSFET enables simple single-ended fly-back topology at a high efficiency level for use in auxiliary power supplies
  • SMD package enables direct integration into PCB, with natural convection cooling without extra heatsink
  • Reduced isolation effort due to extended creepage and clearance distances of package
  • Reduced system complexity
  • High power density

Infineon CoolSiC™ 1700 V SiC Trench MOSFET in TO-263-7 package


Diagram

Infineon 1700V SiC mosfet in simple single-ended flyback converter