TE Connectivity SFP56 Series

SFP56 series zSFP+ stacked interconnects

TE’s new zSFP+ Stacked Interconnects are designed to transfer data rates at up to 56 Gbps PAM-4 while offering high faceplate density for hyperscale data centers and networking switch applications

TE Connectivity SFP56 Series Stacked Interconnects

TE’s new zSFP+ Stacked Interconnects are designed to transfer data rates at up to 56 Gbps PAM-4 while offering high faceplate density for hyperscale data centers and networking switch applications. The stacked portfolio can accommodate 3 row belly-to-belly applications for increased density and maximum PCB space savings.

 

Features

  • Each of the products in our SFP portfolio of I/O interconnects is designed to transfer data at speeds of up to 28 Gbps NRZ and 56 Gbps PAM-4 signal
  • The stacked portfolio can accommodate 3 row belly-to-belly applications for increased density and maximum PCB space savings
  • Share the same mating interface and cage dimensions with the entire SFP28 portfolio
  • Allow for a simple upgrade path from 28 Gbps to 56 Gbps applications
  • Enhanced airflow cage design can provide great thermal performance and can be customized to address customer’s LED light pipe requirements

 

Applications

  • Switch
  • Server
  • Router
  • Storage
  • Test equipment

TE Connectivity SFP56 Series Stacked Interconnects | Avnet Abacus

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