TE Connectivity MicroQSFP Connectors

MicroQSFP interconnect solutions

TE Connectivity (TE) introduces new microQSFP pluggable I/O single high cages and surface mount connectors. TE is the first company to bring micro Quad Small Form-Factor Pluggable (microQSFP) interconnects to market from the microQSFP Multi Source Agreement (MSA), providing a higher density solution for next generation pluggable connectivity. microQSFP provides QSFP28 functionality in a smaller, generally SFP-sized form factor while providing significantly better thermal performance to help save energy costs, improved electrical performance at 25 Gbps NRZ / 56 Gbps PAM-4 and 33% higher density than QSFP to fit more ports on a standard line card. 

TE Connectivity microQFSP pluggable I/O singe high cages and surface mount connectors Avnet Abacus

Features/Applications

Features Applications
  • Save space on the PC board with a 33% higher density design than existing QSFP form factors 
  • Improve thermal performance with built-in fins on the connector that allow faceplate airflow to the interior of the equipment
  • Double the thermal capability of today’s QSFP products 
  • Support next generation designs with standardized form factor and 25 Gbps NRZ / 56 Gbps PAM-4 performance and backwards compatibility to 28 Gbps
  • Enable up to 7.2 Tbps in a standard 1RU line card with 72 ports (when operating at 25 Gbps per channel)
  • Networking switches
  • Routers
  • Servers (blade, rack mountable and multi-node)
  • Networking interface cards 
  • Optical transport equipment
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