TE Connectivity LGA 3647 Socket & Hardware

LGA 3647 socket and hardware

TE Connectivity’s (TE) LGA 3647 socket and hardware meet the next-generation designs of Intel Corporation’s (Intel) new CPU processors for higher performance and better system scaling. LGA 3647 socket is the first to feature a two-piece design that improves issues with warpage and offers better coplanarity and reliability. As one of a limited number of suppliers offering LGA 3647, TE has both socket and hardware parts available to bring you a full solution. 

TE Connectivity LGA 3647 socket and hardware INTEL CPU Avnet Abacus

Features/Applications

Features Applications
  • Meet next-generation design with LGA 3647 sockets and hardware that meet Intel’s next-generation CPU processors 
  • Provide higher performance, better system application scaling and better value with new socket and hardware design
  • Offer better coplanarity and reliability with a two-piece design that improves issues with warpage 
  • Help improve alignment and keep fingers away from the socket contact field with fabric and non-fabric carrier hardware
  • Assist in orientation and alignment for the processor heatsink module (PHM) and the spring load force necessary for socket loading with the bolster plate hardware
  • Supply mounting points for the bolster plate with back plate hardware

 

  • Servers
  • Storage
  • Data centers
  • High-performance computing

 

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