TE Connectivity ChipConnect Cable Assemblies

ChipConnect cable assemblies

TE Connectivity’s (TE) ChipConnect internal faceplate-to-processor cable assemblies are designed for Intel Omni-Path Architecture (OPA), which can directly transmit signals from the processor to the faceplate. ChipConnect cable assemblies mate directly with LGA 3647 sockets at the processor and Intel Omni-Path Internal Faceplate Transition (IFT) connector at the faceplate for 25 Gbps speeds.

These cable assemblies reduce system design costs by eliminating the need to use costlier, lower-loss printed circuit board (PCB) materials. System design is made easier by reducing the complexity of PCB laminates and routing, as well as retimers.
 

Internal Faceplate-to-Processor Cable Assemblies for Intel® Omni-Path Architecture 100 Series

Features/Applications

Features Applications
  • Cables provide 4x and 8x high speed data transmission lanes
  • Straight and right-angle (left/right exit) Linear Edge Connector (LEC) cable plugs to accommodate cable routing
  • LEC receptacle offered in A (LGA 3647 Socket P1) and B (LGA 3647 Socket P0) versions
  • Bail latch with pull tab on LEC plug and spring latching on IFT connector plug provides secure connections
  • Mid-board copper chip-to-I/O interconnect reduces host system board trace lengths and PCB cost
  • Assemblies utilize TE bulk cable 30 AWG 85 Ohm TurboTwin 25 Gbps primary pair cable
  • High Performance Computing (HPC)
  • Servers
  • Routers
  • Data Center and Enterprise Networks
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