Samtec Z-Ray® Ultra Low Profile Interposers

Z-Ray® ultra low profile interposers

Z-Ray® micro array interposers are ultralow profile, high density, highly customisable solutions for board-to-board, IC-to-board, and cable-to-board applications.

Samtec Z-Ray® ultra low profile interposers

Features and benefits

 
  • Low profile body height (down to 0.5 mm) in a one piece design
  • High performance up to 28+ Gbps
  • Choice of 0.8 mm or 1.00 mm pitch grid
  • Variety of standard and custom configurations
  • Customer-specific pin counts for ultimate high density and speed flexibility
  • Customer-specific stack heights, insulator shapes, and plating thicknesses
  • Dual compression or single compression and solder ball
  • An array of sizes and shapes
    • Square, rectangle
    • Customer-specific shapes
    • Alignment and screw hole options
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