Soft-PGS with low thermal resistance

Panasonic Automotive & Industrial Systems Europe has launched a highly-compressible Thermal Interface Material (TIM) to reduce contact thermal resistance between rough surfaces in extremely thin spaces.

Soft-PGS enhances the thermal coupling between heat producing devices (heat sources) and heat dissipation devices (heat sinks). Soft-PGS can be compressed by 40%, whichwhich enables reducing the thermal resistance by following gap, warpage, and distortion of  targets/substrates. Soft-PGS fits uneven surfaces far better offering superior workability, reliability and thermo stability.

 

Panasonic Soft-PGS with Low Thermal Resistance

Features/Applications

Features Applications
  • Thermal resistance : 0.2K∙cm2/W (600 kPa)
  • Thermal conductivity : X-Y direction 400W/m∙K
  • Compressibility : 40 % (600k Pa)
  • High and long term reliability : operating temperature range –55 to 400 °C
  • Easy to install

For cooling/heat transfer of electronic devices that generates heat, such as power modules.

  • Inverters and converters
  • Car-mounted camera, motor control unit, automotive LED, luminous source of laser HUD, medical equipment
  • Base station, Server
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