Based on a 1.27 by 1.27mm grid pattern, this high-current density board-to-board interconnect solution offers complete design flexibility and higher
current density per inch to support variety of data, automotive, industrial and consumer board-to-board and cable-to-board applications.
Ensures robust connector retention when mated
Single-sided Polarization Slot
Prevents wrong orientation and mis-mating. Improves mating for smaller circuit sizes of 6 and below
Locating Pegs (Shrouded Right Angle Header, Through-hole)
Ensure precise connector positioning on PCB
Energy efficient appliances
Smart Phones and Mobile Devices
Portable electronic devices
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