TE Connectivity MS5525DSO Series

TE Connectivity MS5525DSO 5PSIG digital pressure sensor

The TE Connectivity MS5525DSO is a new generation of Digital Small Outline pressure sensors from MEAS with SPI and I2C bus interface designed for high volume OEM users. The sensor module includes a pressure sensor and an ultra-low power 24-bit ΔΣ ADC with internal factory calibrated coefficients. It provides a 24-bit digital pressure and temperature value and different operation modes that allow the user to optimise for conversion speed and current consumption. The MS5525DSO can be interfaced to virtually any microcontroller. The communication protocol is simple, without the need of programming internal registers in the device.

This new sensor module generation is based on leading MEMS technology and latest benefits from TE Connectivity proven experience and know-how in high volume manufacturing of pressure modules, which have been widely used for over a decade.

The rugged engineered thermoplastic transducer is available in single and dual port configurations, and can measure absolute, gauge, compound, and differential pressure from 1 to 30psi.

3M has presented New 3M™ 100G QSFP28 Direct Attach Copper Cable Assemblies, 9Q Series are passive copper cable assemblies which utilize 3M Twin Axial Cable technology to create a highly-flexible, foldable, high-performance solution.

Features/Applications

Features Applications
  • Integrated digital pressure sensor (24-bit ΔΣ ADC)
  • Fast conversion Down to 1 ms
  • Low power, 1 μA (standby < 0.15 μA)
  • Supply voltage: 1.8 to 3.6V
  • Pressure range: 1 to 30 PSI
  • I2C and SPI Interface
  • Small outline IC package
  • Barbed pressure ports
  • Low power, high resolution ADC
  • Digital pressure and temperature outputs
  • Factory automation
  • Altitude and airspeed measurements
  • Medical instruments
  • Leak detection
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