Samtec FireFly™ Micro Flyover System™

The FireFly™ Micro Flyover System™ is the first interconnect system that gives a designer the flexibility of using micro footprint optical and copper interconnects interchangeably with the same connector system.

The FireFly™ system enables chip-to-chip, board-to-board, on-board and system-to-system connectivity at data rates up to 28 Gbps. FireFly™ is based on a high performance interconnect system which allows the use of low-cost copper cables or high performance active optical engines.

Samtec FlyFly™ Micro Flyover System™ and Cable Assembly

Features and Benefits

Low profile micro flyover cable assembly (ECUE Series) Ext. Temp. active optical micro flyover cable assembly (ETUO Series) Active optical micro flyover cable assembly (ECUO Series)
  • Performance up to 28 Gbps
  • A large variety of connector termination options
  • 50Ω 38 AWG micro ribbon coax cable
  • Capability to enable test and verification of connectors during manufacturing
  • Designed for on-board or on-package placement
  • Multiple signal mapping options
  • Passive and active equalised versions available (ECUE-E series)
  • x4 full-duplex or x12 half-duplex transceiver systems
  • 14 Gbps and 28 Gbps (in development) options
  • Proven 850 nm VCSEL array technology
  • Available in panel mount or full Tx-to-Rx active optical cable
  • Protocol agnostic and supports all data center and HPC protocols
  • Designed for on-board or on-package placement
  • A large variety of connector termination options
  • Multiple heat sink options
  • Extended temperature range from -40 ºC to +85 ºC
  • High-speed performance to 10.3125 Gbps per channel
  • x12 simplex or x12 duplex optical transceiver system
  • Integral heat sink provides optimal cooling for thermal operating conditions
  • A large variety of connector termination options
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