Samtec ExaMAX® High-Speed Backlane Systems

ExaMAX® high speed & micro backplane systems

Increasing data rates, denser systems and shrinking product footprints challenge designers to meet their systems’ high-speed interconnect needs. Samtec provides engineers the service, products, tools and resources to optimise the entire system signal chain from the backplane to the front panel.

ExaMAX® high-speed backplane systems deliver 28 Gbps of electrical performance while offering an easy migration path to 56 Gbps. A choice of 28 Gbps performance on a 2.00 mm column pitch, or 56 Gbps performance on a 3.00 mm column pitch, gives designers the option of optimizing density or minimizing board layer count for high-speed backplane applications.

Samtec ExaMAX® High-Speed Backplane Systems

Features and benefits

  • Enables 28 Gbps electrical performance on 2.00 mm column pitch
  • Exceeds OIF CEI-28G-LR specification for 28 Gbps standards
  • Individual signal wafers in a staggered, differential pair design:
    • 72-pair design: 6-pair x 12 column
    • 40-pair design: 4-pair x 10 column
  • Wafer incorporates a one-piece embossed ground structure
  • Increased isolation significantly reduces crosstalk
  • Ground placement engineered for 92Ω option addresses both 85Ω and 100Ω applications
  • Balanced differential pairs are arranged in columns with zero skew
  • Press-fit tails provide a reliable electrical connection between the connector and the board
  • Blind mate capable with built-in macro and micro guidance modules that allow for selfcapture, self-alignment and mating without damage
  • High power modules deliver bulk current to mating power components at 80 A per module
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