Amphenol ICC MEG-Array® mezzanine connector system

The MEG-Array® mezzanine connector system provides the high density and high-speed benefits of a large array supported by the reliability and low costs of standard surface mount PCB assembly.

1.27mm x 1.27mm array of discrete circuit contacts allows flexible ground distribution to optimize high-speed signal integrity at speeds up to 32Gb/s. MEG-Array® is offered in a variety of PCB mezzanine stack heights.

Amphenol's advanced manufacturing supports a patented BGA interconnect design. Multiple in-process vision systems monitor BGA contact integrity including solder sphere size, location, and co-planarity plus other critical-to-function attributes.

  • Data rate: up to 32Gb/s documented
  • Array grid size: 1.27mm x 1.27mm
  • 17 billion+ lines shipped to customer satisfaction
Amphenol MEG-Array® mezzanine connector system


Features Applications
  • High density, high speed, discrete contact, array connector in the revolutionary BGA platform
  • Flexible ground distribution
  • 32Gb/s differential pair performance documented for 4mm and 6mm stack height
  • Online s-parameter files and signal integrity performance reports
  • 1.27mm x 1.27mm grid provides 71 contacts per cm2 density
  • Dual-point, long wipe contacts
  • Choice of six stack heights from 4mm to 14mm and choice of eight sizes from 81 to 528 positions
  • High-density standard BGA attachment
  • BGA features natural surface tension property
  • Patented BGA contact attachment


  • Communications
    • Transmission
    • Access
    • Switching
    • Optics
    • Networking
  • Data
    • Servers
    • Storage
  •  Industrial & instrumentation
    • Industrial controls & equipment
    • Analytical & diagnostic
    • Medical
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