XCR3384XL-12TQG144C by Xilinx | CPLDs | Avnet AMERICAS
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XCR3384XL-12TQG144C

Xilinx

CPLD CoolRunner XPLA3 Family 9K Gates 384 Macro Cells 83MHz 0.35um (CMOS) Technology 3.3V 144-Pin TQFP

Manufacturer Part #: XCR3384XL-12TQG144C

Alternate Part #: XCR3384XL-12TQG144C


RoHS Compliant

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The CoolRunner XPLA3 (eXtended Programmable Logic Array) family of CPLDs is targeted for low power systems that include portable, handheld, and power sensitive applications. Each member of the CoolRunner XPLA3 family includes Fast Zero Power (FZP) design technology that combines low power and high speed. With this design technique, the CoolRunner XPLA3 family offers true pin-to-pin speeds of 5.0 ns, while simultaneously delivering power that is less than 56 μW at standby without the need for "turbo bits" or other power down schemes. By replacing conventional sense amplifier methods for implementing product terms (a technique that has been used in PLDs since the bipolar era) with a cascaded chain of pure CMOS gates, the dynamic power is also substantially lower than any other CPLD. CoolRunner devices are the only TotalCMOS PLDs, as they use both a CMOS process technology and the patented full CMOS FZP design technique. The FZP design technique combines fast nonvolatile memory cells with ultra-low power SRAM shadow memory to deliver the industry’s lowest power 3.3V CPLD family.

The CoolRunner XPLA3 family employs a full PLA structure for logic allocation within a function block. The PLA provides maximum flexibility and logic density, with superior pin locking capability, while maintaining deterministic timing.

CoolRunner XPLA3 CPLDs are supported by Xilinx® WebPACK software and industry standard CAE tools (Mentor, Cadence/OrCAD, Exemplar Logic, Synopsys, Viewlogic, and Synplicity), using HDL editors with ABEL, VHDL, and Verilog, and/or schematic capture design entry. Design verification uses industry standard simulators for functional and timing simulation. Development is supported on multiple personal computer (PC), Sun, and HP platforms.

The CoolRunner XPLA3 family features also include the industry-standard, IEEE 1149.1, JTAG interface through which boundary-scan testing, In-System Programming (ISP), and reprogramming of the device can occur. The CoolRunner XPLA3 CPLD is electrically reprogrammable using industry standard device programmers.

Key Features

  • Fast Zero Power (FZP) design technique provides ultra-low power and very high speed
    • Typical Standby Current of 17 to 18 μA at 25°C
  • Innovative CoolRunner™ XPLA3 architecture combines high speed with extreme flexibility
  • Based on industry's first TotalCMOS PLD — both CMOS design and process technologies
  • Advanced 0.35μ five layer metal EEPROM process
    • 1,000 erase/program cycles guaranteed
    • 20 years data retention guaranteed
  • 3V, In-System Programmable (ISP) using JTAG IEEE 1149.1 interface
    • Full Boundary-Scan Test (IEEE 1149.1)
    • Fast programming times
  • Support for complex asynchronous clocking
    • 16 product term clocks and four local control term clocks per function block
    • Four global clocks and one universal control term clock per device
  • Excellent pin retention during design changes
  • Available in commercial grade and extended voltage (2.7V to 3.6V) industrial grade
  • 5V tolerant I/O pins
  • Input register setup time of 2.5 ns
  • Single pass logic expandable to 48 product terms
  • High-speed pin-to-pin delays of 5.0 ns
  • Slew rate control per output
  • 100% routable
  • Security bit prevents unauthorized access
  • Supports hot-plugging capability
  • Design entry/verification using Xilinx or industry standard CAE tools
  • Innovative Control Term structure provides:
    • Asynchronous macrocell clocking
    • Asynchronous macrocell register preset/reset
    • Clock enable control per macrocell
  • Four output enable controls per function block
  • Foldback NAND for synthesis optimization
  • Universal 3-state which facilitates "bed of nails" testing
  • Available in Chip-scale BGA, Fineline BGA, and QFP packages. Pb-free available for most package types.

Technical Attributes

Description
Value
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Maximum Operating Supply Voltage
3.6 V
Individual Output Enable Control
No
Maximum Internal Frequency
100 MHz
Number of Macro Cells
384
Pin Count
144
Maximum Propagation Delay Time
12 ns
Number of Product Terms per Macro
48
Speed Grade
12
Minimum Operating Supply Voltage
3 V
Product Dimensions
20 x 20 x 1.4 mm
Memory Type
EEPROM
Device System Gates
9000
Lead Finish
Matte Tin
MSL Level
3
Number of User I/Os
118
Mounting
Surface Mount
Max Processing Temp
260
Re-programmability Support
Yes
In System Programmability
Yes
Typical Operating Supply Voltage
3.3 V
Screening Level
Commercial
Supplier Package
TQFP
Fabrication Technology
0.35um (CMOS)
Operating Temperature
0 to 70 °C
Number of Logic Blocks/Elements
24
Maximum Operating Frequency
83 MHz

ECCN / UNSPSC

Description
Value
ECCN:
EAR99
SCHEDULE B:
8542390000
HTSN:
8542390001
UNSPSC:
32101643
UNSPSC VERSION:
V15.1101
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