These octal flip-flops are designed specifically for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.
The eight flip-flops of the ´LVT574 are edge-triggered D-type flip-flops. On the positive transition of the clock (CLK) input, the Q outputs are set to the logic levels set up at the data (D) inputs.
A buffered output-enable OE input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without need for interface or pullup components.OE does not affect the internal operations of the flip-flops. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.
Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
The SN74LVT574 is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area.
The SN54LVT574 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74LVT574 is characterized for operation from -40°C to 85°C.
State-of-the-Art Advanced BiCMOS Technology (ABT) Design for3.3-V Operation and Low Static Power Dissipation
Support Mixed-Mode Signal Operation (5-V Input and OutputVoltages With 3.3-V VCC)
Support Unregulated Battery Operation Down to 2.7 V
Typical VOLP (Output Ground Bounce)< 0.8 V atVCC = 3.3 V, TA = 25°C
ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015;Exceeds 200 V Using Machine Model(C = 200 pF, R = 0)
Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
Bus-Hold Data Inputs Eliminate the Need for External PullupResistors
Support Live Insertion
Package Options Include Plastic Small-Outline (DW), ShrinkSmall-Outline (DB), and Thin Shrink Small-Outline (PW) Packages,Ceramic Chip Carriers (FK), Ceramic Flat (W) Packages, and Ceramic(J) DIPs