The GSI Technology 288Mb Low Latency DRAM (LLDRAM) II is a high speed memory device designed for high address rate data processing typically found in networking and telecommunications applications. The 8-bank architecture and low tRC allows access rates formerly only found in SRAMs.The Double Data Rate (DDR) I/O interface provides high bandwidth data transfers, clocking out two beats of data per clock cycle at the I/O balls. Source-synchronous clocking can be implemented on the host device with the provided free running data output clock.Commands, addresses, and control signals are single data rate signals clocked in by the True differential input clock transition, while input data is clocked in on both crossings of the input data clock(s).Read and Write data transfers always in short bursts. The burst length is programmable to 2, 4 or 8 by setting the Mode Register.The device is supplied with 2.5 V VEXT and 1.8 V VDD for the core, and 1.5 V or 1.8 V for the HSTL output drivers.Internally generated row addresses facilitate bank-scheduled refresh.The device is delivered in an efficient mBGA 144-ball package.
Pin and function-compatible with Micron RLDRAM® II
533 MHz DDR operation (1.067Gb/s/pin data rate)
38.4 Gb/s peak bandwidth (x36 at 533 MHz clock frequency)
8M x 36, 16M x 18, and 32M x 9 organizations available
8 internal banks for concurrent operation and maximum bandwidth