The SN65LVDS109 is configured as two identical banks, each bank having one differential line receiver connected to either four ('109) or eight ('117) differential line drivers. The outputs are arranged in pairs having one output from each of the two banks. Individual output enables are provided for each pair of outputs and an additional enable is provided for all outputs.
The line receivers and line drivers implement the electrical characteristics of low-voltage differential signaling (LVDS). LVDS, as specified in EIA/TIA-644, is a data signaling technique that offers low power, low noise emission, high noise immunity, and high switching speeds. (Note: The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media, the noise coupling to the environment, and other system characteristics.)
The intended application of these devices, and the LVDS signaling technique, is for point-to-point or point-to-multipoint (distributed simplex) baseband data transmission on controlled impedance media of approximately 100Ω. The transmission media may be printed-circuit board traces, backplanes, or cables. The large number of drivers integrated into the same silicon substrate, along with the low pulse skew of balanced signaling, provides extremely precise timing alignment of the signals being repeated from the inputs. This is particularly advantageous for implementing system clock and data distribution trees.
The SN65LVDS109 and SN65LVDS117 are characterized for operation from –40°C to 85°C.
Two Line Receivers and Eight ('109) or Sixteen ('117) Line Drivers Meet or Exceed the Requirements of ANSI EIA/TIA-644 Standard
Typical Data Signaling Rates to 400 Mbps or Clock Frequencies to 400 MHz
Outputs Arranged in Pairs From Each Bank
Enabling Logic Allows Individual Control of Each Driver Output Pair, Plus All Outputs
Low-Voltage Differential Signaling With Typical Output Voltage of 350 mV and a 100-Ω Load
Electrically Compatible With LVDS, PECL, LVPECL, LVTTL, LVCMOS, GTL, BTL, CTT, SSTL, or HSTL Outputs With External Termination Networks
Propagation Delay Times < 4.5 ns
Output Skew Less Than 550 psBank Skew Less Than150 ps Part-to-Part Skew Less Than 1.5 ns
Total Power Dissipation Typically <500 mW With All Ports Enabled and at 200 MHz
Bus-Pin ESD Protection Exceeds 12 kV
Packaged in Thin Shrink Small-Outline Package With 20-Mil Terminal Pitch