devices are based on the enhanced OMAP 3 architecture.
The OMAP 3 architecture is designed to provide best-in-class video, image, and graphics processing sufficient to support the following:
High-resolution still image
The device supports high-level operating systems (HLOSs), such as:
This OMAP device includes state-of-the-art power-management techniques required for high-performance mobile products.
The following subsystems are part of the device:
Microprocessor unit (MPU) subsystem based on the ARM Cortex-A8microprocessor
PowerVR SGX subsystem for 3D graphics acceleration to support display(OMAP35 deviceonly)
Camera image signal processor (ISP) that supports multiple formats andinterfacing options connected to a wide variety of image sensors
Display subsystem with a wide variety of features for multiple concurrent imagemanipulation, and a programmable interface supporting a wide variety of displays. The displaysubsystem also supports NTSC and PAL video out.
Level 3 (L3) and level 4 (L4) interconnects that provide high-bandwidth datatransfers for multiple initiators to the internal and external memory controllers and to on-chipperipherals
The device also offers:
A comprehensive power- and clock-management scheme that enables high-performance,low-power operation, and ultralow-power standby features. The device also supports SmartReflexadaptative voltage control. This power-management technique for automatic control of the operatingvoltage of a module reduces the active power consumption.
Memory-stacking feature using the package-on-package (POP) implementation (CBBand CBC packages only)
OMAP35 devices are available in a 515-pin s-PBGA package (CBB suffix), 515-pin s-PBGA package (CBC suffix), and a 423-pin s-PBGA package (CUS suffix). Some features of the CBB and CBC packages are not available in the CUS package. (See Table 1-1 for package differences).
This data manual presents the electrical and mechanical specifications for the OMAP35 applications processors. The information in this data manual applies to both the commercial and extended temperature versions of the OMAP35 applications processors unless otherwise indicated. This data manual consists of the following sections: