The 'BCT8244A scan test devices with octal buffers are members of the Texas Instruments SCOPETM testability integrated-circuit family. This family of devices supports IEEE Standard 1149.1-1990 boundary scan to facilitate testing of complex circuit-board assemblies. Scan access to the test circuitry is accomplished via the 4-wire test access port (TAP) interface.
In the normal mode, these devices are functionally equivalent to the 'F244 and 'BCT244 octal buffers. The test circuitry can be activated by the TAP to take snapshot samples of the data appearing at the device terminals or to perform a self test on the boundary-test cells. Activating the TAP in normal mode does not affect the functional operation of the SCOPETM octal buffers.
In the test mode, the normal operation of the SCOPETM octal buffers is inhibited and the test circuitry is enabled to observe and control the I/O boundary of the device. When enabled, the test circuitry can perform boundary-scan test operations, as described in IEEE Standard 1149.1-1990.
Four dedicated test terminals control the operation of the test circuitry: test data input (TDI), test data output (TDO), test mode select (TMS), and test clock (TCK). Additionally, the test circuitry performs other testing functions such as parallel-signature analysis (PSA) on data inputs and pseudo-random pattern generation (PRPG) from data outputs. All testing and scan operations are synchronized to the TAP interface.
The SN54BCT8244A is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74BCT8244A is characterized for operation from 0°C to 70°C.
Members of the Texas Instruments SCOPETM Family ofTestability Products
Octal Test-Integrated Circuits
Functionally Equivalent to 'F244 and 'BCT244 in theNormal-Function Mode
Compatible With the IEEE Standard 1149.1-1990 (JTAG) TestAccess Port and Boundary-Scan Architecture
Test Operation Synchronous to Test Access Port (TAP)
Implement Optional Test Reset Signal by Recognizing aDouble-High-Level Voltage (10 V) on TMS Pin
SCOPETM Instruction Set
IEEE Standard 1149.1-1990 Required Instructions, Optional INTEST, CLAMP and HIGHZ
Parallel-Signature Analysis at Inputs
Pseudo-Random Pattern Generation From Outputs
Sample Inputs/Toggle Outputs
Package Options Include Plastic Small-Outline (DW) Packages,Ceramic Chip Carriers (FK), and Standard Plastic and Ceramic300-mil DIPs (JT, NT)