EXBD10C331J by Panasonic | Resistor Networks & Arrays | Avnet EMEA
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EXBD10C331J

Panasonic

Res Thick Film NET 330 Ohm 5% ±200ppm/°C BUS Molded 10-Pin 1206 Concave SMD Punched Carrier T/R

Manufacturer Part #: EXBD10C331J

Avnet Manufacturer Part #: EXBD10C331J


RoHS Compliant

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Information

Res Thick Film NET 330 Ohm 5% ±200ppm/°C BUS Molded 10-Pin 1206 Concave SMD Punched Carrier T/R

Key Features

  • High density placing for digital signal circuits
    • Bussed 8 or 15 resistors for pull up/down circuits EXBD: 3.2 mm × 1.6 mm × 0.55 mm, 0.635 mm pitch
    • Available direct placing on the bus line by means of half pitch spacing without through-holes on PWB (“High density placing” is shown below)
  • High speed mounting using conventional placing machine
  • Reference Standard…IEC 60115-9, JIS C 5201-9, EIAJ RC-2130
  • RoHS compliant

Technical Attributes

Description
Value
Find similar Parts
Power Rating per Resistor
1/20 W
Product Length
3.2 mm
Terminal Pitch
0.64 mm
Termination Style
Concave
Lead Finish
Tin
Package Type
SMD
Type
Network
Mounting
Surface Mount
Max Processing Temp
260 °C
Case Size
1206 in
Resistance Value
330 Ohm
Temperature Coefficient
±200 ppm/°C
Technology
Thick Film
Case Style
Molded
Tolerance
5 %
Circuit Designator
BUS
Operating Temperature
-55 to 125 °C
Number of Resistors
8
Product Dimensions
3.2 x 1.6 x 0.55 mm
Number of Terminals
10

ECCN / UNSPSC

Description
Value
ECCN:
EAR99
SCHEDULE B:
8533210025
HTSN:
8533210020
UNSPSC:
32121607
UNSPSC VERSION:
V15.1101
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