Multilayer ceramic capacitors are available in avariety of physical sizes and configurations, includingleaded devices and surface mounted chips. Leadedstyles include molded and conformally coated partswith axial and radial leads. However, the basiccapacitor element is similar for all styles. It is called achip and consists of formulated dielectric materialswhich have been cast into thin layers, interspersedwith metal electrodes alternately exposed on oppositeedges of the laminated structure. The entire structure isfired at high temperature to produce a monolithicblock which provides high capacitance values in asmall physical volume. After firing, conductiveterminations are applied to opposite ends of the chip tomake contact with the exposed electrodes.Termination materials and methods vary depending onthe intended use.